公开(公告)号：US20230274853A1

公开(公告)日：2023-08-31

申请号：US18016313

申请日：2021-06-30

Applicant: CLAP CO., LTD

Inventor： SeonWoo LEE

IPC: H01B5/14 ,  H01B13/00 ,  C08G73/18 ,  C08L39/08 ,  C09D151/00 ,  C09D5/00 ,  C09D1/00

CPC classification number: H01B5/14 ,  H01B13/0016 ,  H01B13/0036 ,  C08G73/18 ,  C08L39/08 ,  C09D151/003 ,  C09D5/002 ,  C09D1/00

Abstract: The invention relates to thin metal electrode films for use in high-performance device systems comprising: a substrate; an underlayer; and a primer layer coated with metal coating. The thin metal electrode film has metal wiring with high resolution on a substrate and thus has excellent electrical properties. The invention also relates to a method for manufacturing thin metal electrode film.