公开(公告)号：US20240117220A1

公开(公告)日：2024-04-11

申请号：US18378111

申请日：2023-10-09

Applicant: CMC Materials LLC

Inventor： Alex Villani-Gale ,  Elliot Knapton ,  Brian Reiss

IPC: C09G1/02 ,  C09K13/00 ,  H01L21/306

CPC classification number: C09G1/02 ,  C09K13/00 ,  H01L21/30625

Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive; (b) an oxidizing agent; and (c) water, wherein the chemical-mechanical polishing composition has a pH of about 2 or less. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising a boron-doped polysilicon layer on a surface of the substrate, using said composition.