公开(公告)号：US20210212175A1

公开(公告)日：2021-07-08

申请号：US17048123

申请日：2019-04-16

Applicant: CONCEPT GROUP LLC

Inventor： David H. REID, Jr. ,  Aarne H. REID ,  Shriram RADHAKRISHNAN ,  Michael Cline MURRAY ,  Peter ROACH

IPC: H05B6/10 ,  B29C64/295 ,  B33Y30/00 ,  B22F12/13 ,  B33Y40/10

Abstract: Provided are thermally insulated modules that comprise a first shell and a first component having a first sealed evacuated insulating space therebetween and a current carrier configured to give rise to inductive heating. Also provided are methods of utilizing the disclosed thermally insulated modules in a variety of applications, including additive manufacturing and other applications.

公开(公告)号：US20210062957A1

公开(公告)日：2021-03-04

申请号：US17048194

申请日：2019-04-17

Applicant: CONCEPT GROUP LLC

Inventor： Shriram RADHAKRISHNAN ,  David H. REID, Jr. ,  Aarne H. REID ,  Peter ROACH ,  William THOMAS ,  George LEDOUX ,  Michael Cline MURRAY

IPC: F16L59/065

Abstract: Provided are thermally insulating components that include sealed joints between the walls that define an insulating space therebetween. Also provided are related methods of forming and using the disclosed components.