公开(公告)号：US20210088173A1

公开(公告)日：2021-03-25

申请号：US16630010

申请日：2018-07-12

Applicant: CONCEPT GROUP LLC

Inventor： Shriram RADHAKRISHNAN ,  Aarne H. REID ,  David H. REID, Jr.

IPC: F16L59/065 ,  B32B5/02

Abstract: Provided are vacuum-insulated articles that comprise an evacuated space disposed between first and second walls and a reflective material disposed within the evacuated space. Also provided are methods of fabricating such articles.

公开(公告)号：US20200326028A1

公开(公告)日：2020-10-15

申请号：US16761972

申请日：2018-11-06

Applicant: CONCEPT GROUP LLC

Inventor： Shriram RADHAKRISHNAN ,  David H. REID, Jr. ,  Aarne H. REID

IPC: F16L59/065 ,  A47J41/02

Abstract: Provided are thermally insulated modules that comprise a first shell and a first component having a first sealed evacuated insulating space therebetween and a current carrier configured to give rise to inductive heating. Also provided are methods of utilizing the disclosed thermally insulated modules in a variety of applications, including additive manufacturing and other applications.

公开(公告)号：US20220349513A1

公开(公告)日：2022-11-03

申请号：US17778115

申请日：2020-11-20

Applicant: CONCEPT GROUP LLC

Inventor： Shriram RADHAKRISHNAN ,  David H. REID, Jr. ,  Peter ROACH

IPC: F16L59/065 ,  F16L59/14

Abstract: Provided are self-recovering insulating components, comprising: a first boundary in a first configuration; and a second boundary in a first configuration, the first boundary and the second boundary defining a sealed evacuated insulating space therebetween, the sealed insulating space defining a degree of vacuum, and the first boundary, the second boundary, or both and the degree of vacuum being selected such that (i) upon deformation of at least one of the first boundary and the second boundary sufficient to place the first boundary and the second boundary into direct thermal communication with one another at a contact location, (ii) the at least one of the first boundary and the second boundary recovers from the deformation so as to place the component into a recovered configuration free of direct thermal communication between the first boundary and second boundary at the contact location

公开(公告)号：US20210212175A1

公开(公告)日：2021-07-08

申请号：US17048123

申请日：2019-04-16

Applicant: CONCEPT GROUP LLC

Inventor： David H. REID, Jr. ,  Aarne H. REID ,  Shriram RADHAKRISHNAN ,  Michael Cline MURRAY ,  Peter ROACH

IPC: H05B6/10 ,  B29C64/295 ,  B33Y30/00 ,  B22F12/13 ,  B33Y40/10

Abstract: Provided are thermally insulated modules that comprise a first shell and a first component having a first sealed evacuated insulating space therebetween and a current carrier configured to give rise to inductive heating. Also provided are methods of utilizing the disclosed thermally insulated modules in a variety of applications, including additive manufacturing and other applications.

公开(公告)号：US20210062957A1

公开(公告)日：2021-03-04

申请号：US17048194

申请日：2019-04-17

Applicant: CONCEPT GROUP LLC

Inventor： Shriram RADHAKRISHNAN ,  David H. REID, Jr. ,  Aarne H. REID ,  Peter ROACH ,  William THOMAS ,  George LEDOUX ,  Michael Cline MURRAY

IPC: F16L59/065

Abstract: Provided are thermally insulating components that include sealed joints between the walls that define an insulating space therebetween. Also provided are related methods of forming and using the disclosed components.