公开(公告)号：US20210088173A1

公开(公告)日：2021-03-25

申请号：US16630010

申请日：2018-07-12

Applicant: CONCEPT GROUP LLC

Inventor： Shriram RADHAKRISHNAN ,  Aarne H. REID ,  David H. REID, Jr.

IPC: F16L59/065 ,  B32B5/02

Abstract: Provided are vacuum-insulated articles that comprise an evacuated space disposed between first and second walls and a reflective material disposed within the evacuated space. Also provided are methods of fabricating such articles.

公开(公告)号：US20200326028A1

公开(公告)日：2020-10-15

申请号：US16761972

申请日：2018-11-06

Applicant: CONCEPT GROUP LLC

Inventor： Shriram RADHAKRISHNAN ,  David H. REID, Jr. ,  Aarne H. REID

IPC: F16L59/065 ,  A47J41/02

Abstract: Provided are thermally insulated modules that comprise a first shell and a first component having a first sealed evacuated insulating space therebetween and a current carrier configured to give rise to inductive heating. Also provided are methods of utilizing the disclosed thermally insulated modules in a variety of applications, including additive manufacturing and other applications.

公开(公告)号：US20210356216A1

公开(公告)日：2021-11-18

申请号：US17296346

申请日：2019-11-26

Applicant: CONCEPT GROUP LLC

Inventor： Shriram RADHAKRISHNAN ,  David H. REID, JR. ,  Aarne H. REID ,  Peter ROACH ,  Lucas PYE

IPC: F28D15/04 ,  F28F13/14

Abstract: Provided are heat transfer components that include a wick and a working fluid enclosed within a sealed evacuated space. Also provided are related methods of using the components.

公开(公告)号：US20210212175A1

公开(公告)日：2021-07-08

申请号：US17048123

申请日：2019-04-16

Applicant: CONCEPT GROUP LLC

Inventor： David H. REID, Jr. ,  Aarne H. REID ,  Shriram RADHAKRISHNAN ,  Michael Cline MURRAY ,  Peter ROACH

IPC: H05B6/10 ,  B29C64/295 ,  B33Y30/00 ,  B22F12/13 ,  B33Y40/10

Abstract: Provided are thermally insulated modules that comprise a first shell and a first component having a first sealed evacuated insulating space therebetween and a current carrier configured to give rise to inductive heating. Also provided are methods of utilizing the disclosed thermally insulated modules in a variety of applications, including additive manufacturing and other applications.

公开(公告)号：US20210062957A1

公开(公告)日：2021-03-04

申请号：US17048194

申请日：2019-04-17

Applicant: CONCEPT GROUP LLC

Inventor： Shriram RADHAKRISHNAN ,  David H. REID, Jr. ,  Aarne H. REID ,  Peter ROACH ,  William THOMAS ,  George LEDOUX ,  Michael Cline MURRAY

IPC: F16L59/065

Abstract: Provided are thermally insulating components that include sealed joints between the walls that define an insulating space therebetween. Also provided are related methods of forming and using the disclosed components.