公开(公告)号：US3832603A

公开(公告)日：1974-08-27

申请号：US33967373

申请日：1973-03-09

Applicant: CONTROL DATA CORP

Inventor： CRAY S ,  ROUSH M

IPC: H01R12/51 ,  H05K3/30 ,  H05K3/36 ,  H05K5/00

CPC classification number: H01R12/523 ,  H05K3/308 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/10333 ,  H05K2201/10962

Abstract: Circuit elements on circuit boards of a stacked assembly are electrically interconnected by interconnect devices located in a pseudo-random array on the boards. The interconnect devices include rigid, elongated members extending through the region separating adjacent circuit boards and assembled to receiver means, such as recesses, located in housings supported by an adjacent circuit board.

Abstract translation: 层叠组件的电路板上的电路元件通过位于板上的伪随机阵列中的互连装置电互连。 互连装置包括延伸穿过隔离相邻电路板的区域的刚性的细长构件，并组装到位于由相邻电路板支撑的壳体中的接收装置，例如凹部。