Method of measuring underfill profile of underfill cavity having solder bumps

    公开(公告)号:US11355361B1

    公开(公告)日:2022-06-07

    申请号:US17381515

    申请日:2021-07-21

    IPC分类号: H01L21/56 H01L23/00 H01L21/66

    摘要: The present disclosure provides a method for measuring an underfill profile of an underfill material in an underfill cavity having a plurality of solder bumps. The method includes the operations of: determining a mesh having a plurality of elements according to the underfill cavity; calculating a reference force according to the underfill cavity; obtaining a driving force and a flow speed of the underfill material according to a plurality of weighting factors and the reference force, wherein the plurality of weighting factors respectively correspond to the plurality of elements; obtaining a plurality of volume fractions respectively corresponding to the plurality of elements according to the flow speed; and obtaining the underfill profile according to the plurality of volume fractions.

    Method of mesh generation for resin transfer molding process

    公开(公告)号:US11602908B1

    公开(公告)日:2023-03-14

    申请号:US17564744

    申请日:2021-12-29

    摘要: The present disclosure provides a method of mesh generation for an RTM process, including operations of: obtaining a geometry of a target object; generating a solid mesh of the target object according to the geometry; obtaining material characteristics of the target object; assembling a runner mesh with the solid mesh, wherein the runner mesh has grid dimensions different from those of the solid mesh; determining process parameters of the RTM process; and generating a forecasted result of the RTM process according to the solid mesh, the runner mesh, the process parameters, and the material characteristics. Generating the solid mesh includes operations of: dividing the geometry into modules; generating a first and second modular meshes corresponding to a first and second modules, wherein the second modular mesh abuts the first modular mesh, and the second modular mesh has grid dimensions different from those of the first modular mesh.