VAPORIZERS AND APPARATUSES FOR FORMING GLASS OPTICAL FIBER PREFORMS COMPRISING THE SAME

    公开(公告)号:US20200255319A1

    公开(公告)日:2020-08-13

    申请号:US16782319

    申请日:2020-02-05

    Abstract: Vaporizers and systems for vaporizing liquid precursor for forming glass optical fiber preforms are provided. The vaporizer includes an expansion chamber at least partially enclosed by a side wall, the expansion chamber comprising an upper end and a lower end with the side wall disposed between the upper end and the lower end. The vaporizer further includes a closed-loop liquid delivery conduit positioned in the expansion chamber proximate to the upper end of the expansion chamber, wherein the closed-loop liquid delivery conduit comprises a plurality of nozzles oriented to direct a spray of liquid precursor onto an inner surface of the side wall. Further, the vaporizer includes at least one supply conduit positioned proximate the upper end of the expansion chamber and coupled to the closed-loop liquid delivery conduit, and a vapor delivery outlet coupled to the expansion chamber and configured to direct vaporized liquid precursor from the expansion chamber.

    FIXED BED BIOREACTOR VESSEL AND METHODS OF USING THE SAME

    公开(公告)号:US20230348834A1

    公开(公告)日:2023-11-02

    申请号:US17779044

    申请日:2020-10-30

    CPC classification number: C12M25/18 C12M27/24

    Abstract: A packed-bed bioreactor is provided that includes: a vessel having an interior cavity defined by an outer wall; and a center column disposed within the interior cavity. The center column includes a columnar sidewall defining an inner region within the center column, the columnar sidewall separating the inner region from an outer region within the interior cavity. The bioreactor further includes a cell culture substrate disposed in the outer region of the cavity, the cell culture substrate surrounding the center column; at least one port extending through the vessel for at least one supply and removal of media to or from the interior cavity; and a fountain head element disposed above the center column.

    Methods and apparatus comprising a first conduit circumscribed by a second conduit

    公开(公告)号:US11338257B2

    公开(公告)日:2022-05-24

    申请号:US16675786

    申请日:2019-11-06

    Abstract: A fluid distributor comprises a first conduit extending along a first elongated axis and a second conduit circumscribing the first conduit. A first area comprises a cross-sectional flow area of the first conduit taken perpendicular to the first elongated axis. The first conduit comprises a first plurality of orifices comprising a first combined cross-sectional area. The second conduit comprises a second plurality of orifices comprising a second combined cross-sectional area. A first ratio of the first area to the first combined cross-sectional area can be about 2 or more. A second ratio of the first combined cross-sectional area to the second combined cross-sectional area can be about 2 or more. An angle between a direction of an orifice axis of a first orifice of the first plurality of orifices and a direction of an orifice axis of a first orifice of the second plurality of orifices can be from about 45° to 180°.

    LOW THERMAL RESISTANCE POWER MODULE PACKAGING

    公开(公告)号:US20200312740A1

    公开(公告)日:2020-10-01

    申请号:US16826641

    申请日:2020-03-23

    Abstract: Embodiments of the disclosure relate to a method of preparing a direct plated substrate. In the method, a dielectric layer is provided that has a first major surface, a second major surface opposite to the first major surface, and a thickness between the first major surface and the second major surface. The thickness of the dielectric layer is no more than 100 μm. A first metal layer is applied to the first major surface of the dielectric layer. A second metal layer is applied to the second major surface of the dielectric layer. A base plate is joined to the second metal layer, and a metal substrate is joined to the first metal layer. A direct plated substrate made according to the method is also described herein.

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