公开(公告)号：US20220098082A1

公开(公告)日：2022-03-31

申请号：US17477940

申请日：2021-09-17

Applicant: CORNING INCORPORATED

Inventor： Alejandro Antonio Becker ,  Benjamin Paul Foerg ,  Tobias Christian Roeder ,  Uwe Stute

IPC: C03B33/07 ,  C03B33/02 ,  B23K26/362 ,  B23K26/402

Abstract: A method of laser processing a coated substrate having a coating later disposed on a transparent workpiece that includes determining an optical characteristic of the coating layer and selecting a beam path for a pulsed laser beam based on the optical characteristic. The beam path is selected a polarization-adjusting beam path and a frequency-adjusting beam path. The method also includes directing the pulsed laser beam down the selected beam path to form a modified pulsed laser beam and directing the modified pulsed laser beam into the transparent workpiece, where the modified pulsed laser beam forms a laser beam focal line that induces absorption in the transparent workpiece to produce a defect in the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ ⁢ w o 2 λ , where FD is a dimensionless divergence factor.