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    METHODS FOR ADJUSTING BEAM PROPERTIES FOR LASER PROCESSING COATED SUBSTRATES
    3.
    发明申请
    METHODS FOR ADJUSTING BEAM PROPERTIES FOR LASER PROCESSING COATED SUBSTRATES 有权

    公开(公告)号：US20220098082A1

    公开(公告)日：2022-03-31

    申请号：US17477940

    申请日：2021-09-17

    Applicant: CORNING INCORPORATED

    Inventor： Alejandro Antonio Becker ,  Benjamin Paul Foerg ,  Tobias Christian Roeder ,  Uwe Stute

    IPC: C03B33/07 ,  C03B33/02 ,  B23K26/362 ,  B23K26/402

    Abstract: A method of laser processing a coated substrate having a coating later disposed on a transparent workpiece that includes determining an optical characteristic of the coating layer and selecting a beam path for a pulsed laser beam based on the optical characteristic. The beam path is selected a polarization-adjusting beam path and a frequency-adjusting beam path. The method also includes directing the pulsed laser beam down the selected beam path to form a modified pulsed laser beam and directing the modified pulsed laser beam into the transparent workpiece, where the modified pulsed laser beam forms a laser beam focal line that induces absorption in the transparent workpiece to produce a defect in the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ ⁢ w o 2 λ , where FD is a dimensionless divergence factor.

    METHODS FOR LASER FORMING TRANSPARENT ARTICLES FROM A TRANSPARENT MOTHER SHEET AND PROCESSING THE TRANSPARENT ARTICLES IN-SITU
    4.
    发明申请
    METHODS FOR LASER FORMING TRANSPARENT ARTICLES FROM A TRANSPARENT MOTHER SHEET AND PROCESSING THE TRANSPARENT ARTICLES IN-SITU 审中-公开

    公开(公告)号：US20190263709A1

    公开(公告)日：2019-08-29

    申请号：US16276109

    申请日：2019-02-14

    Applicant: Corning Incorporated

    Inventor： Alejandro Antonio Becker

    IPC: C03B33/02 ,  C03B33/07 ,  B23K26/402 ,  B23K26/38 ,  B23K26/0622

    Abstract: A method for processing a transparent mother sheet includes forming one or more closed contours in the transparent mother sheet that each define a perimeter of a transparent article. Forming each of the one or more closed contours includes directing a pulsed laser beam into the transparent mother sheet to produce defect within the transparent mother sheet and translating the transparent mother sheet and the pulsed laser beam relative to each other thereby laser forming defects along the one or more closed contours. The method further includes separating a portion of the transparent mother sheet along the closed contours, thereby forming one or more transparent articles, where the transparent articles are frictionally engaged with a frame portion of the transparent mother sheet, applying material to a surface the transparent articles, and releasing the transparent articles from frictional engagement with the frame portion.

    METHODS FOR LASER PROCESSING TRANSPARENT MATERIAL USING PULSED LASER BEAM FOCAL LINES
    9.
    发明申请
    METHODS FOR LASER PROCESSING TRANSPARENT MATERIAL USING PULSED LASER BEAM FOCAL LINES 有权

    公开(公告)号：US20220274210A1

    公开(公告)日：2022-09-01

    申请号：US17677371

    申请日：2022-02-22

    Applicant: CORNING INCORPORATED

    Inventor： Alejandro Antonio Becker ,  Tobias Christian Roeder

    IPC: B23K26/53 ,  B23K26/0622 ,  B23K26/06 ,  B23K26/073

    Abstract: A method for processing a transparent workpiece includes forming a first contour line, comprising a first plurality of defects, in the transparent workpiece; forming a second contour line, comprising a second plurality of defects, in the transparent workpiece, wherein the second contour line defines a second contour intersecting the first contour line at an intersection point, wherein the laser pulse energy of the second pulsed laser beam is increased from a first laser pulse energy to a second laser pulse energy at a first distance from the intersection point; and wherein the laser pulse energy of the second pulsed laser beam is decreasing from the second laser pulse energy to the first laser pulse energy at a second distance from the intersection point.

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