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    METHODS FOR ADJUSTING BEAM PROPERTIES FOR LASER PROCESSING COATED SUBSTRATES
    1.
    发明申请
    METHODS FOR ADJUSTING BEAM PROPERTIES FOR LASER PROCESSING COATED SUBSTRATES 有权

    公开(公告)号：US20220098082A1

    公开(公告)日：2022-03-31

    申请号：US17477940

    申请日：2021-09-17

    Applicant: CORNING INCORPORATED

    Inventor： Alejandro Antonio Becker ,  Benjamin Paul Foerg ,  Tobias Christian Roeder ,  Uwe Stute

    IPC: C03B33/07 ,  C03B33/02 ,  B23K26/362 ,  B23K26/402

    Abstract: A method of laser processing a coated substrate having a coating later disposed on a transparent workpiece that includes determining an optical characteristic of the coating layer and selecting a beam path for a pulsed laser beam based on the optical characteristic. The beam path is selected a polarization-adjusting beam path and a frequency-adjusting beam path. The method also includes directing the pulsed laser beam down the selected beam path to form a modified pulsed laser beam and directing the modified pulsed laser beam into the transparent workpiece, where the modified pulsed laser beam forms a laser beam focal line that induces absorption in the transparent workpiece to produce a defect in the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ ⁢ w o 2 λ , where FD is a dimensionless divergence factor.

    REAL-TIME MODIFICATION OF LINE FOCUS INTENSITY DISTRIBUTION
    2.
    发明申请
    REAL-TIME MODIFICATION OF LINE FOCUS INTENSITY DISTRIBUTION 有权

    公开(公告)号：US20220326539A1

    公开(公告)日：2022-10-13

    申请号：US17708027

    申请日：2022-03-30

    Applicant: CORNING INCORPORATED

    Inventor： Reinhard Moritz Malchus ,  Tobias Christian Roeder

    IPC: G02B27/28 ,  G02F1/33 ,  B23K26/064 ,  B23K26/38 ,  C03B33/02 ,  C03C23/00

    Abstract: Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.

    Systems, methods, and apparatuses for in machine profiling of a laser beam
    3.
    发明授权
    Systems, methods, and apparatuses for in machine profiling of a laser beam 有权

    公开(公告)号：US10982998B2

    公开(公告)日：2021-04-20

    申请号：US16536559

    申请日：2019-08-09

    Applicant: Corning Incorporated

    Inventor： Thomas Hackert ,  Tobias Christian Roeder ,  Uwe Stute

    IPC: G01J1/42 ,  B23K26/53 ,  B23K26/073 ,  G01B11/28 ,  G01J1/44

    Abstract: A laser system includes a controller comprising a processor and a non-transitory machine-readable memory, a laser head configured to output a laser beam, a work bed positioned opposite the laser head, and a power meter communicatively coupled to the electronic control unit and integrated within the work bed. The laser system further includes a knife edge plate positioned between the power meter and the laser head, and a machine-readable instruction set stored in the non-transitory machine readable memory that causes the laser system to perform at least the following when executed by the processor: position the laser head at a distance from the power meter, cause the laser head to output the laser beam, translate the laser head across the power meter, receive power signals from the power meter as the laser beam is translated across the power meter, and calculate a spot size based on the power signals.

    METHODS FOR LASER PROCESSING TRANSPARENT MATERIAL USING PULSED LASER BEAM FOCAL LINES
    5.
    发明申请
    METHODS FOR LASER PROCESSING TRANSPARENT MATERIAL USING PULSED LASER BEAM FOCAL LINES 有权

    公开(公告)号：US20220274210A1

    公开(公告)日：2022-09-01

    申请号：US17677371

    申请日：2022-02-22

    Applicant: CORNING INCORPORATED

    Inventor： Alejandro Antonio Becker ,  Tobias Christian Roeder

    IPC: B23K26/53 ,  B23K26/0622 ,  B23K26/06 ,  B23K26/073

    Abstract: A method for processing a transparent workpiece includes forming a first contour line, comprising a first plurality of defects, in the transparent workpiece; forming a second contour line, comprising a second plurality of defects, in the transparent workpiece, wherein the second contour line defines a second contour intersecting the first contour line at an intersection point, wherein the laser pulse energy of the second pulsed laser beam is increased from a first laser pulse energy to a second laser pulse energy at a first distance from the intersection point; and wherein the laser pulse energy of the second pulsed laser beam is decreasing from the second laser pulse energy to the first laser pulse energy at a second distance from the intersection point.

    SYSTEMS, METHODS, AND APPARATUSES FOR IN MACHINE PROFILING OF A LASER BEAM
    6.
    发明申请
    SYSTEMS, METHODS, AND APPARATUSES FOR IN MACHINE PROFILING OF A LASER BEAM 审中-公开

    公开(公告)号：US20200049552A1

    公开(公告)日：2020-02-13

    申请号：US16536559

    申请日：2019-08-09

    Applicant: Corning Incorporated

    Inventor： Thomas Hackert ,  Tobias Christian Roeder ,  Uwe Stute

    IPC: G01J1/42 ,  G01J1/44 ,  G01B11/28 ,  B23K26/073 ,  B23K26/53

    Abstract: A laser system includes a controller comprising a processor and a non-transitory machine-readable memory, a laser head configured to output a laser beam, a work bed positioned opposite the laser head, and a power meter communicatively coupled to the electronic control unit and integrated within the work bed. The laser system further includes a knife edge plate positioned between the power meter and the laser head, and a machine-readable instruction set stored in the non-transitory machine readable memory that causes the laser system to perform at least the following when executed by the processor: position the laser head at a distance from the power meter, cause the laser head to output the laser beam, translate the laser head across the power meter, receive power signals from the power meter as the laser beam is translated across the power meter, and calculate a spot size based on the power signals.

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