公开(公告)号：US20210291494A1

公开(公告)日：2021-09-23

申请号：US17260333

申请日：2019-07-09

Applicant: CORNING INCORPORATED

Inventor： Bethany Jon Alderman ,  Patrick Joseph Cimo ,  Kuan-Ting Kuo ,  Robert Lee Smith, III

IPC: B32B17/10 ,  B32B7/12 ,  B32B27/36 ,  C03B23/037 ,  B32B37/12

Abstract: A cover element for an electronic device that includes a redrawn glass element, first and second primary surfaces, and a polymeric layer disposed over the first primary surface. The redrawn glass element has a reduced thickness and an average surface roughness of 1 nanometer or less. Further, the cover element can withstand a pen drop height of greater than 6 centimeters or 2.5 times or more than that of a control pen drop height of the cover element having a non-redrawn glass element the layer according to Drop Test 1.

公开(公告)号：US12103885B2

公开(公告)日：2024-10-01

申请号：US17269558

申请日：2019-08-06

Applicant: CORNING INCORPORATED

Inventor： Bethany Jon Alderman ,  Patrick Joseph Cimo ,  Kuan-Ting Kuo ,  Robert Lee Smith, III

IPC: B32B15/04 ,  B32B17/06 ,  C03B23/037 ,  C03C4/18 ,  C03C10/00 ,  C03C15/00 ,  C03C21/00

CPC classification number: C03B23/037 ,  C03C4/18 ,  C03C10/0018 ,  C03C15/00 ,  C03C21/002 ,  C03C2204/00

Abstract: A cover element for an electronic device that includes a glass element having a thickness from 20 μm to 125 μm, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.

公开(公告)号：US20210331961A1

公开(公告)日：2021-10-28

申请号：US17269558

申请日：2019-08-06

Applicant: CORNING INCORPORATED

Inventor： Bethany Jon Alderman ,  Patrick Joseph Cimo ,  Kuan-Ting Kuo ,  Robert Lee Smith, III

IPC: C03B23/037 ,  C03C4/18 ,  C03C10/00 ,  C03C15/00 ,  C03C21/00 ,  H05K5/03 ,  H05K5/00

Abstract: A cover element for an electronic device that includes a glass element having a thickness from 20 μm to 125 μm, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.