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公开(公告)号:US20210291494A1
公开(公告)日:2021-09-23
申请号:US17260333
申请日:2019-07-09
Applicant: CORNING INCORPORATED
Inventor: Bethany Jon Alderman , Patrick Joseph Cimo , Kuan-Ting Kuo , Robert Lee Smith, III
IPC: B32B17/10 , B32B7/12 , B32B27/36 , C03B23/037 , B32B37/12
Abstract: A cover element for an electronic device that includes a redrawn glass element, first and second primary surfaces, and a polymeric layer disposed over the first primary surface. The redrawn glass element has a reduced thickness and an average surface roughness of 1 nanometer or less. Further, the cover element can withstand a pen drop height of greater than 6 centimeters or 2.5 times or more than that of a control pen drop height of the cover element having a non-redrawn glass element the layer according to Drop Test 1.
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公开(公告)号:US12103885B2
公开(公告)日:2024-10-01
申请号:US17269558
申请日:2019-08-06
Applicant: CORNING INCORPORATED
Inventor: Bethany Jon Alderman , Patrick Joseph Cimo , Kuan-Ting Kuo , Robert Lee Smith, III
CPC classification number: C03B23/037 , C03C4/18 , C03C10/0018 , C03C15/00 , C03C21/002 , C03C2204/00
Abstract: A cover element for an electronic device that includes a glass element having a thickness from 20 μm to 125 μm, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.
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公开(公告)号:US20210331961A1
公开(公告)日:2021-10-28
申请号:US17269558
申请日:2019-08-06
Applicant: CORNING INCORPORATED
Inventor: Bethany Jon Alderman , Patrick Joseph Cimo , Kuan-Ting Kuo , Robert Lee Smith, III
Abstract: A cover element for an electronic device that includes a glass element having a thickness from 20 μm to 125 μm, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.
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