公开(公告)号：US20210405278A1

公开(公告)日：2021-12-30

申请号：US17363655

申请日：2021-06-30

Applicant: CORNING INCORPORATED

Inventor： Venkatesh Botu ,  Roni Daniel Levi ,  Christian Alexander Rothenbach Stacey ,  Andrew Joseph Sullivan ,  James Andrew West

IPC: F21V8/00

Abstract: A transparent illumination system and related light guide plate is provided. The system is configured to facilitate total internal reflection propagation of light through the light guide plate despite low index of refraction differences between the glass material of the light guide layer and the adjacent layer. The system includes a light source, such as a laser diode, and an optical element to fan out light from the light source in the plane of the light guide plate. The light guide plate includes internal light extraction features.

公开(公告)号：US11644609B2

公开(公告)日：2023-05-09

申请号：US17363655

申请日：2021-06-30

Applicant: CORNING INCORPORATED

Inventor： Venkatesh Botu ,  Roni Daniel Levi ,  Christian Alexander Rothenbach Stacey ,  Andrew Joseph Sullivan ,  James Andrew West

IPC: F21V8/00

CPC classification number: G02B6/0041 ,  G02B6/003 ,  G02B6/0051

Abstract: A transparent illumination system and related light guide plate is provided. The system is configured to facilitate total internal reflection propagation of light through the light guide plate despite low index of refraction differences between the glass material of the light guide layer and the adjacent layer. The system includes a light source, such as a laser diode, and an optical element to fan out light from the light source in the plane of the light guide plate. The light guide plate includes internal light extraction features.

公开(公告)号：US20240371693A1

公开(公告)日：2024-11-07

申请号：US18652102

申请日：2024-05-01

Applicant: CORNING INCORPORATED

Inventor： Andreas Simon Gaab ,  Nicolai Martin Haenel ,  Roni Daniel Levi ,  Bernhard Anton Moegele ,  Ralf Joachim Terbrueggen

IPC: H01L21/768 ,  H01L21/20 ,  H01L21/683

Abstract: Methods, systems, and devices implementing techniques for dicing bonded wafers using laser technologies are described. A bonded wafer includes an optically transmissive substrate bonded with a semiconductor substrate. The optically transmissive substrate is irradiated using a first laser technology associated with perforating the optically transmissive substrate to form damage tracks. The semiconductor substrate is irradiated using a second laser technology associated with forming damage regions within the semiconductor substrate. The damage regions of the semiconductor substrate are aligned with the damage tracks of the optically transmissive substrate during irradiation of the semiconductor substrate or the optically transmissive substrate, forming an aligned region through the bonded wafer with a relatively high likelihood for fracture. After irradiating the optically transmissive substrate and the semiconductor substrate, one or more forces may be applied to the bonded wafer to separate the bonded wafer into respective dies along the aligned region.

公开(公告)号：US20200283325A1

公开(公告)日：2020-09-10

申请号：US16809960

申请日：2020-03-05

Applicant: CORNING INCORPORATED

Inventor： Roni Daniel Levi ,  Michael Brian Webb

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/064 ,  B23K26/364 ,  B23K26/53

Abstract: A method for processing a transparent workpiece includes forming a closed contour in the transparent workpiece. The closed contour includes a plurality of defects in the transparent workpiece and has a rectilinear shape. Forming the closed contour includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece to generate an induced absorption within the transparent workpiece and produce a defect within the transparent workpiece. Forming the closed contour also includes translating the pulsed laser beam focal line along a closed contour line having the rectilinear shape, thereby laser forming the plurality of defects of the closed contour. In addition, the method for processing the transparent workpiece includes etching the transparent workpiece with a chemical etching solution to separate a portion of the transparent workpiece along the closed contour, thereby forming an aperture extending through the transparent workpiece.