公开(公告)号：US20250157812A1

公开(公告)日：2025-05-15

申请号：US18947441

申请日：2024-11-14

Applicant: CORNING INCORPORATED

Inventor： Jason Roy Grenier ,  Sung-Il Kim ,  Han-Kyom Lee ,  Daniel Wayne Levesque, JR. ,  Robert Anthony Schaut ,  Seong-ho Seok

IPC: H01L21/02 ,  H01L21/306 ,  H01L21/768

Abstract: Methods for forming a through-glass vias in glass-based substrates include irradiating a glass-based substrate with a laser beam to form a damage track extending from a first major surface to a second major surface of the glass-based substrate, and contacting the glass-based substrate with a first etchant, including a base, to form a preliminary through-glass via. The method includes contacting the glass-based substrate with a second etchant, including an acid. The contacting with the second etchant widens a first cross-sectional area of the preliminary through-glass via at the first major surface of the glass-based substrate and widens a second cross-sectional area of the preliminary through-glass via at the second major surface of the glass-based substrate.