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公开(公告)号：US20240351945A1
公开(公告)日：2024-10-24
申请号：US18687920
申请日：2022-08-23
Applicant: CORNING INCORPORATED
Inventor： Daniel Wayne Levesque, JR. , Lina Ma , Heather Nicole Vanselous , Jingshi Wu
CPC classification number: C03C23/0025 , C03C10/0036 , C03C15/00 , C03C2204/00
Abstract: A method of forming a glass ceramic substrate having a through-glass via can include treating at least a portion of a first major surface of a precursor glass substrate along a laser scan path with a source of laser energy to form a treated precursor glass substrate. The through-glass via has a predetermined shape and extends through the first major surface of the glass ceramic substrate and a second major surface of the glass ceramic substrate. The first major surface defines a first opening and the second major surface defining a second opening and a ratio of a waist diameter of the through-glass via, measured at a location between the first opening and the second opening, to a surface diameter of the through-glass via, measured at either the first opening of the second opening of the through-glass via is in a range of from about 30% to about 100%.
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公开(公告)号：US20180105455A1
公开(公告)日：2018-04-19
申请号：US15783536
申请日：2017-10-13
Applicant: Corning Incorporated
CPC classification number: C03C15/00 , B01L3/5027 , B01L2300/0887 , B01L2300/0896 , B23K26/0006 , B23K26/36 , B82Y20/00 , C03B33/0222 , G01R1/06711 , G01R1/06727 , G02B6/107
Abstract: A device includes a sheet of high purity fused silica that has a thickness of less than 500 μm, where the sheet includes features in the sheet, wherein the features have a cross-sectional dimension of less than 50 μm and a depth of at least 100 nm, wherein the features are spaced apart from one another by a distance of less than 50 μm, and wherein the silica is free of indicia of grinding and polishing.
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公开(公告)号：US20230341986A1
公开(公告)日：2023-10-26
申请号：US17763353
申请日：2020-09-23
Applicant: CORNING INCORPORATED
Inventor： Ya-Huei Chang , Daniel Wayne Levesque, JR. , Jen-Chieh Lin , Lu Zhang
CPC classification number: G06F3/0448 , G06F3/0446 , G06F3/0412 , G06F2203/04103
Abstract: Embodiments are related generally to display devices, and more particularly to displays or display tiles having electrodes that extend from a first surface to a second surface of a substrate.
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Patent Agency Ranking
公开(公告)号：US20190312067A1
公开(公告)日：2019-10-10
申请号：US15972628
申请日：2018-05-07
Applicant: CORNING INCORPORATED
Inventor： Sean Matthew Garner , Daniel Wayne Levesque, JR. , Robert George Manley , Garrett Andrew Piech , Rajesh Vaddi , Heather Nicole Vanselous
Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.
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5.发明申请公开(公告)号：US20190119150A1
公开(公告)日：2019-04-25
申请号：US16162644
申请日：2018-10-17
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Daniel Wayne Levesque, JR. , Sasha Marjanovic , Garrett Andrew Piech , Heather Nicole Vanselous , Kristopher Allen Wieland
Abstract: A method for processing a transparent workpiece includes forming a closed contour line having a plurality of defects in the transparent workpiece such that the closed contour line defines a closed contour. Forming the closed contour line includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, and translating the transparent workpiece and the pulsed laser beam relative to each other along the closed contour line. The method further includes etching the transparent workpiece with a chemical etching solution at an etching rate of about 2.5 μm/min or less to separate a portion of the transparent workpiece along the closed contour line, thereby forming an aperture extending through the transparent workpiece, the aperture comprising an aperture perimeter extending along the closed contour.
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公开(公告)号：US20190074240A1
公开(公告)日：2019-03-07
申请号：US16179048
申请日：2018-11-02
Applicant: CORNING INCORPORATED
Inventor： Daniel Wayne Levesque, JR. , Garrett Andrew Piech , Aric Bruce Shorey
IPC: H01L23/48 , H01L21/48 , H01L21/311 , B81B7/00 , B81C1/00 , H01L21/268 , H01L21/306 , H01L21/683 , H01L21/762 , H01L21/768 , H01L23/498
Abstract: A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.
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公开(公告)号：US20180068868A1
公开(公告)日：2018-03-08
申请号：US15696736
申请日：2017-09-06
Applicant: Corning Incorporated
Inventor： Andres Covarrubias Jaramillo , Yuhui Jin , Frank Andrew Kramer, IV , Ekaterina Aleksandrovna Kuksenkova , Daniel Wayne Levesque, JR. , Garrett Andrew Piech , Aric Bruce Shorey , Robert Stephen Wagner
IPC: H01L21/48 , C03C15/00 , C03C23/00 , H01L23/538 , H01L23/498
CPC classification number: H01L21/4807 , C03C15/00 , C03C23/0025 , H01L21/486 , H01L23/15 , H01L23/49827 , H01L23/49838 , H01L23/5384 , H01L23/5386 , H01L2224/16225
Abstract: Articles including a glass-based substrate with holes, semiconductor packages including an article with holes, and methods of fabricating holes in a substrate are disclosed. In one embodiment, an article includes a glass-based substrate having a first surface, a second surface, and at least one hole extending from the first surface. The at least one hole has an interior wall having a surface roughness Ra that is less than or equal to 1 μm. The at least one hole has a first opening having a first diameter that is present the first surface. A first plane is defined by the first surface of the glass-based substrate based on an average thickness of the glass-based substrate. A ratio of a depression depth to the first diameter of the at least one hole is less than or equal to 0.007.
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公开(公告)号：US20180005922A1
公开(公告)日：2018-01-04
申请号：US15630363
申请日：2017-06-22
Applicant: CORNING INCORPORATED
Inventor： Daniel Wayne Levesque, JR. , Garrett Andrew Piech , Aric Bruce Shorey
IPC: H01L23/48 , B81C1/00 , H01L21/268 , H01L21/683 , H01L21/311 , B81B7/00 , H01L21/762 , H01L21/768 , H01L21/306
CPC classification number: H01L23/481 , B81B7/0006 , B81B2207/096 , B81C1/00301 , B81C2201/013 , B81C2201/0143 , B81C2203/031 , H01L21/268 , H01L21/30604 , H01L21/31105 , H01L21/31111 , H01L21/486 , H01L21/6835 , H01L21/76251 , H01L21/76877 , H01L21/76898 , H01L23/49827 , H01L2221/68359
Abstract: A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.
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