公开(公告)号：US20230167001A1

公开(公告)日：2023-06-01

申请号：US17993320

申请日：2022-11-23

Applicant: CORNING INCORPORATED

Inventor： Jason Roy Grenier ,  Nickolaos Savidis ,  Craig John Mancusi Ungaro

IPC: C03B33/02 ,  B23K26/53 ,  B23K26/0622 ,  B23K26/384 ,  C03B33/04

CPC classification number: C03B33/0222 ,  B23K26/53 ,  B23K26/0624 ,  B23K26/384 ,  C03B33/04 ,  B23K26/08

Abstract: A method of separating a substrate includes directing a laser beam into the substrate such that a focal line is formed with at least a portion of the laser beam focal line within a bulk of the substrate at an oblique angle with respect to a laser-incident surface of the substrate. The laser beam focal line is formed by a pulsed laser beam that is disposed along a beam propagation direction. The method further includes pulsing the pulsed laser beam from a first edge of the substrate to a second edge of the substrate in a single pass. The laser beam focal line generates an induced multi-photon absorption within the substrate that produces a damage track within the bulk of the substrate along the laser beam focal line, and the damage track is at an oblique angle relative to the laser-incident surface of the substrate.

公开(公告)号：US20250157812A1

公开(公告)日：2025-05-15

申请号：US18947441

申请日：2024-11-14

Applicant: CORNING INCORPORATED

Inventor： Jason Roy Grenier ,  Sung-Il Kim ,  Han-Kyom Lee ,  Daniel Wayne Levesque, JR. ,  Robert Anthony Schaut ,  Seong-ho Seok

IPC: H01L21/02 ,  H01L21/306 ,  H01L21/768

Abstract: Methods for forming a through-glass vias in glass-based substrates include irradiating a glass-based substrate with a laser beam to form a damage track extending from a first major surface to a second major surface of the glass-based substrate, and contacting the glass-based substrate with a first etchant, including a base, to form a preliminary through-glass via. The method includes contacting the glass-based substrate with a second etchant, including an acid. The contacting with the second etchant widens a first cross-sectional area of the preliminary through-glass via at the first major surface of the glass-based substrate and widens a second cross-sectional area of the preliminary through-glass via at the second major surface of the glass-based substrate.

公开(公告)号：US20250128986A1

公开(公告)日：2025-04-24

申请号：US18687025

申请日：2022-08-26

Applicant: CORNING INCORPORATED

Inventor： Jason Roy Grenier ,  Sasha Marjanovic ,  Bertrand Paris ,  Jonathan David Pesansky ,  Kristopher Allen Wieland ,  Ming Ying

IPC: C03C27/02 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/324 ,  B23K26/57 ,  B23K103/00

Abstract: A method of laser bonding glass to metal foil includes contacting a first glass substrate with a first metal foil to create a first contact location; directing a laser beam on the first contact location to bond the first glass substrate to the first metal foil; contacting a second glass substrate with a second metal foil to create a second contact location; and directing the laser beam on the second contact location to bond the second glass substrate to the second metal foil, wherein the first metal foil and the second metal foil each have a thickness from 5 μm to 100 μm, and wherein the laser beam comprises a pulsed laser comprising: a pulse energy from 2.8 μJ to 1000 μJ; and a wavelength such that the first and second glass substrates are substantially transparent to the wavelength.