METHODS OF SEPARATING A SUBSTRATE
    2.
    发明公开

    公开(公告)号:US20240174545A1

    公开(公告)日:2024-05-30

    申请号:US18505608

    申请日:2023-11-09

    IPC分类号: C03B33/033 C03B33/02

    CPC分类号: C03B33/033 C03B33/0222

    摘要: The disclosure relates to a method of laser processing a glass material, including: applying a layer of water to a top surface of a substrate support surface; positioning the glass material onto the substrate support surface, wherein the glass material comprises: a first surface, a second surface opposing the first surface, a plurality of perforations formed within the glass material along a cutting line, wherein the plurality of perforations extends through a thickness of the material from the first surface to the second surface, wherein the water enters into the plurality of perforations via capillary action; and applying a laser to the glass material at the cutting line to expand the water within the plurality of perforations to separate the material.