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公开(公告)号：US20160011381A1
公开(公告)日：2016-01-14
申请号：US14864078
申请日：2015-09-24
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor： Micah Colen Isenhour , James Phillip Luther , Andreas Matiss , Percil Watkins
CPC classification number: G02B6/3886 , G02B6/3849 , G02B6/4204 , G02B6/423 , G02B6/4281 , G02B6/4292
Abstract: Disclosed are optical plugs and optical connectors having one or more integral alignment features used for making optical connections. In one embodiment, an optical connector comprising an optical body and at least one magnetic attachment. The optical body comprises a front side with a first surface, an optical section comprising at least one optical channel, and a datum section disposed on a second surface of the front side and comprising one or more integral alignment features. The optical body also comprises a circuit mounting portion disposed at a rear side of the optical body. The datum section may be arranged on opposite sides of the optical section. Further, the one or more integral alignment feature may be arranged at a top and a bottom of the datum section for alignment in a first direction. The first surface may also be recessed from the second surface.
Abstract translation: 公开了具有用于制造光学连接的一个或多个整体对准特征的光学插头和光学连接器。 在一个实施例中，一种包括光学体和至少一个磁性附件的光学连接器。 光学体包括具有第一表面的前侧，包括至少一个光学通道的光学部分和设置在前侧的第二表面上并且包括一个或多个整体对准特征的基准部分。 光学体还包括设置在光学体的后侧的电路安装部。 基准部分可以布置在光学部分的相对侧上。 此外，一个或多个整体对准特征可以布置在基准部分的顶部和底部，以在第一方向上对准。 第一表面也可以从第二表面凹入。
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2.发明申请公开(公告)号：US20190384007A1
公开(公告)日：2019-12-19
申请号：US16555242
申请日：2019-08-29
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor： Andreas Matiss , James Scott Sutherland
Abstract: A photonic adaptor has a first face side to couple the photonic adaptor to an optical connector and a second face side to couple the photonic adaptor to an optoelectronic substrate. The photonic adaptor comprises a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor. The photonic adaptor comprises at least one alignment pin projecting out of at least the first face side of the photonic adaptor. The at least one alignment pin is configured to be inserted in the optical connector to align optical fibers of an optical cable to the optical fibers of the photonic adaptor.
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公开(公告)号：US20170343747A1
公开(公告)日：2017-11-30
申请号：US15167137
申请日：2016-05-27
Applicant: Corning Optical Communications LLC
CPC classification number: G02B6/423 , G02B6/30 , G02B6/3883 , G02B6/3885 , G02B6/3897 , G02B6/4228 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B6/428 , G02B6/4284 , G02B6/4292
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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公开(公告)号：US10942324B2
公开(公告)日：2021-03-09
申请号：US16553893
申请日：2019-08-28
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor： Alan Frank Evans , Andreas Matiss , Michael Wimmer
Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.
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公开(公告)号：US20190250341A1
公开(公告)日：2019-08-15
申请号：US16392125
申请日：2019-04-23
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
CPC classification number: G02B6/423 , G02B6/30 , G02B6/3883 , G02B6/3885 , G02B6/3897 , G02B6/4228 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B6/428 , G02B6/4284 , G02B6/4292
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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Patent Agency Ranking
公开(公告)号：US20180299627A1
公开(公告)日：2018-10-18
申请号：US16011726
申请日：2018-06-19
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
CPC classification number: G02B6/423 , G02B6/30 , G02B6/3883 , G02B6/3885 , G02B6/3897 , G02B6/4228 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B6/428 , G02B6/4284 , G02B6/4292
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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公开(公告)号：US10031299B2
公开(公告)日：2018-07-24
申请号：US15167137
申请日：2016-05-27
Applicant: Corning Optical Communications LLC
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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8.发明授权公开(公告)号：US10795086B2
公开(公告)日：2020-10-06
申请号：US16555242
申请日：2019-08-29
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor： Andreas Matiss , James Scott Sutherland
Abstract: A photonic adaptor has a first face side to couple the photonic adaptor to an optical connector and a second face side to couple the photonic adaptor to an optoelectronic substrate. The photonic adaptor comprises a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor. The photonic adaptor comprises at least one alignment pin projecting out of at least the first face side of the photonic adaptor. The at least one alignment pin is configured to be inserted in the optical connector to align optical fibers of an optical cable to the optical fibers of the photonic adaptor.
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公开(公告)号：US20190391350A1
公开(公告)日：2019-12-26
申请号：US16553893
申请日：2019-08-28
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor： Alan Frank Evans , Andreas Matiss , Michael Wimmer
Abstract: An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.
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公开(公告)号：US10295762B2
公开(公告)日：2019-05-21
申请号：US16011726
申请日：2018-06-19
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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