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1.
公开(公告)号:US10698167B2
公开(公告)日:2020-06-30
申请号:US15705638
申请日:2017-09-15
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor: Jeffery Alan DeMeritt , Wojciech Piotr Giziewicz , Christopher Paul Lewallen , James Phillip Luther , Jerald Lee Overcash , Rebecca Kayla Schaevitz
IPC: G02B6/42
Abstract: A connector device for connecting optical fiber endpieces comprising an optoelectronic chip, a fiber end piece holder and a reflection surface. The chip is oriented for emitting and/or detecting optical signals along a first propagation direction normal to a circuit board. The reflection surface changes a propagation direction of optical signals from the first propagation direction to a different, second propagation direction and/or vice versa. The connector device comprises a layered optical stack mounted to the circuit board and designed for propagation of optical signals along the first propagation direction. The connector device further comprises a coupling adapter piece mounted to the layered optical stack that holds and/or secures the fiber end piece holder in an orientation enabling propagation of signals radiation along the second propagation direction. The reflection surface for changing between both propagation directions is comprised in the coupling adapter piece.
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2.
公开(公告)号:US10197748B2
公开(公告)日:2019-02-05
申请号:US15691020
申请日:2017-08-30
Applicant: Corning Optical Communications LLC
Inventor: Wojciech Piotr Giziewicz , Christopher Paul Lewallen , James Phillip Luther , Jerald Lee Overcash
Abstract: The application provides a connector device for connecting at least one optical fiber endpiece to an electric terminal. The connector device comprises a printed circuit board and an electric connector plug connectable to an electric terminal. A fiber end piece holder is mounted or mountable in an orientation enabling light propagation parallel to the printed circuit board, whereas an optoelectronic chip comprising optoelectronic active elements enables emission and/or detection of light substantially normal to the printed circuit board. A layered optical stack is provided on the printed circuit board, which layered optical stack comprises a reflection surface for changing the propagation direction between parallel and normal to the printed circuit board.
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公开(公告)号:US20170343747A1
公开(公告)日:2017-11-30
申请号:US15167137
申请日:2016-05-27
Applicant: Corning Optical Communications LLC
CPC classification number: G02B6/423 , G02B6/30 , G02B6/3883 , G02B6/3885 , G02B6/3897 , G02B6/4228 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B6/428 , G02B6/4284 , G02B6/4292
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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公开(公告)号:US10295762B2
公开(公告)日:2019-05-21
申请号:US16011726
申请日:2018-06-19
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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公开(公告)号:US20190250341A1
公开(公告)日:2019-08-15
申请号:US16392125
申请日:2019-04-23
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
CPC classification number: G02B6/423 , G02B6/30 , G02B6/3883 , G02B6/3885 , G02B6/3897 , G02B6/4228 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B6/428 , G02B6/4284 , G02B6/4292
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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公开(公告)号:US20180299627A1
公开(公告)日:2018-10-18
申请号:US16011726
申请日:2018-06-19
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
CPC classification number: G02B6/423 , G02B6/30 , G02B6/3883 , G02B6/3885 , G02B6/3897 , G02B6/4228 , G02B6/4231 , G02B6/4232 , G02B6/4238 , G02B6/4239 , G02B6/428 , G02B6/4284 , G02B6/4292
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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公开(公告)号:US10031299B2
公开(公告)日:2018-07-24
申请号:US15167137
申请日:2016-05-27
Applicant: Corning Optical Communications LLC
Abstract: Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.
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8.
公开(公告)号:US20180017744A1
公开(公告)日:2018-01-18
申请号:US15705638
申请日:2017-09-15
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor: Jeffery Alan DeMeritt , Wojciech Piotr Giziewicz , Christopher Paul Lewallen , James Phillip Luther , Jerald Lee Overcash , Rebecca Kayla Schaevitz
IPC: G02B6/42
Abstract: A connector device for connecting optical fiber endpieces comprising an optoelectronic chip, a fiber end piece holder and a reflection surface. The chip is oriented for emitting and/or detecting optical signals along a first propagation direction normal to a circuit board. The reflection surface changes a propagation direction of optical signals from the first propagation direction to a different, second propagation direction and/or vice versa. The connector device comprises a layered optical stack mounted to the circuit board and designed for propagation of optical signals along the first propagation direction. The connector device further comprises a coupling adapter piece mounted to the layered optical stack that holds and/or secures the fiber end piece holder in an orientation enabling propagation of signals radiation along the second propagation direction. The reflection surface for changing between both propagation directions is comprised in the coupling adapter piece.
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9.
公开(公告)号:US20170363821A1
公开(公告)日:2017-12-21
申请号:US15691020
申请日:2017-08-30
Applicant: Corning Optical Communications LLC
Inventor: Wojciech Piotr Giziewicz , Christopher Paul Lewallen , James Phillip Luther , Jerald Lee Overcash
IPC: G02B6/42
CPC classification number: G02B6/4214 , G02B6/3885 , G02B6/4232 , G02B6/4244 , G02B6/4249 , G02B6/425 , G02B6/428 , G02B6/4284 , G02B6/4292
Abstract: The application provides a connector device for connecting at least one optical fiber endpiece to an electric terminal. The connector device comprises a printed circuit board and an electric connector plug connectable to an electric terminal. A fiber end piece holder is mounted or mountable in an orientation enabling light propagation parallel to the printed circuit board, whereas an optoelectronic chip comprising optoelectronic active elements enables emission and/or detection of light substantially normal to the printed circuit board. A layered optical stack is provided on the printed circuit board, which layered optical stack comprises a reflection surface for changing the propagation direction between parallel and normal to the printed circuit board.
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