公开(公告)号：US09863045B2

公开(公告)日：2018-01-09

申请号：US15080512

申请日：2016-03-24

申请人： COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCH

发明人： Manikka Venkatachalapthi Thulasiram Dhananjeyan ,  Kopula Kesavan Jagadesh ,  GiriNagasamy Kuppusamy Ramesh Babu ,  Somasundaram Ambalavanan ,  Ramachandran Sekar

IPC分类号： C23F1/18 ,  C23C18/40 ,  C23C18/16 ,  C25D1/00 ,  C25D1/08 ,  C25D3/34 ,  C23C18/30

CPC分类号： C23F1/18 ,  C23C18/1648 ,  C23C18/1653 ,  C23C18/1696 ,  C23C18/30 ,  C23C18/405 ,  C25D1/00 ,  C25D1/08 ,  C25D3/34

摘要： The present invention provides a methodology of making lead foam by an electrochemical process in which non-conducting poly urethane foam was metalized using palladium chloride solution which was then coated with lead using the plating bath containing fluoboric acid, Lead as fluoborate solutions, boric acid and urea. The process was operated at a current density ranging from 0.5 A/dm2 to 5 A/dm2, bath pH from 0.5 to 2.0, at temperature range from 30° C. to 50° C., followed with suitable post plating treatments. The surface morphology of the lead foam thus obtained was studied. The composition and purity of the lead foam was characterized with XRD. The porosity obtained depends upon the rate of deposition. The average value of the porosity realized in the range 86-79% with respect to time of deposition 2-6 h and the corresponding thickness of 45 to 60 micron.