公开(公告)号：US10100272B2

公开(公告)日：2018-10-16

申请号：US15327326

申请日：2015-07-17

Applicant: Cabot Microelectronics Corporation

Inventor： Roman Ivanov ,  Cheng-yuan Ko ,  Fred Sun

IPC: C11D7/32 ,  C11D11/00 ,  C11D7/36 ,  C11D7/26 ,  H01L21/02 ,  H01L21/321 ,  H01L21/768

Abstract: The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains a bulky protecting ligand, an organic amine, an organic inhibitor, and water. The invention also provides methods for using the cleaning composition.