公开(公告)号：US11938584B2

公开(公告)日：2024-03-26

申请号：US16868755

申请日：2020-05-07

Applicant: Cabot Microelectronics Corporation

Inventor： Paul Andre Lefevre ,  Devin Schmitt ,  Jaeseok Lee ,  Eric S. Moyer ,  Holland Hodges

IPC: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  C08L75/04

CPC classification number: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  C08L75/04

Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.