公开(公告)号：US09868185B2

公开(公告)日：2018-01-16

申请号：US14931737

申请日：2015-11-03

Applicant: Cabot Microelectronics Corporation

Inventor： Paul Andre Lefevre ,  William C. Allison ,  Diane Scott ,  Jose Arno

IPC: B24B37/22

CPC classification number: B24B37/22 ,  B24B37/205

Abstract: Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.

公开(公告)号：US11938584B2

公开(公告)日：2024-03-26

申请号：US16868755

申请日：2020-05-07

Applicant: Cabot Microelectronics Corporation

Inventor： Paul Andre Lefevre ,  Devin Schmitt ,  Jaeseok Lee ,  Eric S. Moyer ,  Holland Hodges

IPC: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  C08L75/04

CPC classification number: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  C08L75/04

Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.

公开(公告)号：US11440158B2

公开(公告)日：2022-09-13

申请号：US15875773

申请日：2018-01-19

Applicant: Cabot Microelectronics Corporation

Inventor： Diane Scott ,  Paul Andre Lefevre

IPC: B24B37/22 ,  B24B37/24 ,  B24D18/00

Abstract: Coated compressive subpads for polishing pad stacks and methods of fabricating coated compressive subpads for polishing pad stacks are described. In an example, a polishing pad stack for polishing a substrate includes a polishing pad having a polishing surface and a back surface. The polishing pad stack also includes a compressive subpad with a first surface having a first pressure sensitive adhesive layer coated thereon. The first surface of the compressive subpad is coupled directly to the back surface of the polishing pad by the first pressure sensitive adhesive layer.

公开(公告)号：US20170120417A1

公开(公告)日：2017-05-04

申请号：US14931737

申请日：2015-11-03

Applicant: Cabot Microelectronics Corporation

Inventor： Paul Andre Lefevre ,  William C. Allison ,  Diane Scott ,  Jose Arno

IPC: B24B37/22

CPC classification number: B24B37/22 ,  B24B37/205

Abstract: Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.