公开(公告)号：US11938584B2

公开(公告)日：2024-03-26

申请号：US16868755

申请日：2020-05-07

Applicant: Cabot Microelectronics Corporation

Inventor： Paul Andre Lefevre ,  Devin Schmitt ,  Jaeseok Lee ,  Eric S. Moyer ,  Holland Hodges

IPC: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  C08L75/04

CPC classification number: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  C08L75/04

Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.

公开(公告)号：US11845157B2

公开(公告)日：2023-12-19

申请号：US16868965

申请日：2020-05-07

Applicant: Cabot Microelectronics Corporation

Inventor： Eric S. Moyer ,  Lin Fu ,  William Michael Spitzig ,  Chen-Chih Tsai ,  Ping Huang ,  Justin Stewart ,  Carlos Barros

IPC: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y30/00 ,  C08L75/04

CPC classification number: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  C08L75/04

Abstract: A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.