公开(公告)号：US20030143848A1

公开(公告)日：2003-07-31

申请号：US10349987

申请日：2003-01-23

Applicant: Cabot Microelectronics Corporation

Inventor： J. Scott Steckenrider ,  Brian L. Mueller

IPC: C09G001/02 ,  C09G001/04 ,  C09G001/00 ,  C08H001/00 ,  C09D001/00 ,  C09C001/68 ,  B24D003/02 ,  C09K003/14 ,  H01L021/302 ,  H01L021/461

CPC classification number: C09K3/1463 ,  C09G1/02 ,  H01L21/3212

Abstract: An aqueous chemical mechanical polishing slurry useful for polishing the polysilicon layer of a semiconductor wafer comprising an aqueous solution of at least one abrasive, and at least one alcoholamine. The slurry preferably has a pH of from about 9.0 to about 10.5 and it includes an optional buffering agent.