公开(公告)号：US20030124852A1

公开(公告)日：2003-07-03

申请号：US10340561

申请日：2003-01-10

Applicant: Cabot Microelectronics Corporation

Inventor： Mingming Fang ,  Brian L. Mueller ,  James A. Dirksen

IPC: H01L021/302 ,  H01L021/461

CPC classification number: C09G1/02 ,  C09K3/1463 ,  G11B5/8404 ,  H01L21/3212

Abstract: A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.

Abstract translation: 提供了一种用该组合物对表面进行平面化或抛光的组合物和方法。 组合物包含液体载体，化学促进剂和包含约5-90wt。 ％的热解金属氧化物，和约10-95wt。 ％的磨料颗粒，其中约90％或更多的磨料颗粒（数量）具有不大于100nm的粒度。 本发明的组合物可用于以高抛光效率，均匀性和去除速率平坦化或抛光表面，并且具有最小的缺陷性，例如下面的结构和形貌的场损失。