公开(公告)号：US20170120417A1

公开(公告)日：2017-05-04

申请号：US14931737

申请日：2015-11-03

Applicant: Cabot Microelectronics Corporation

Inventor： Paul Andre Lefevre ,  William C. Allison ,  Diane Scott ,  Jose Arno

IPC: B24B37/22

CPC classification number: B24B37/22 ,  B24B37/205

Abstract: Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.

公开(公告)号：US09868185B2

公开(公告)日：2018-01-16

申请号：US14931737

申请日：2015-11-03

Applicant: Cabot Microelectronics Corporation

Inventor： Paul Andre Lefevre ,  William C. Allison ,  Diane Scott ,  Jose Arno

IPC: B24B37/22

CPC classification number: B24B37/22 ,  B24B37/205

Abstract: Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.