公开(公告)号：US11845157B2

公开(公告)日：2023-12-19

申请号：US16868965

申请日：2020-05-07

Applicant: Cabot Microelectronics Corporation

Inventor： Eric S. Moyer ,  Lin Fu ,  William Michael Spitzig ,  Chen-Chih Tsai ,  Ping Huang ,  Justin Stewart ,  Carlos Barros

IPC: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y30/00 ,  C08L75/04

CPC classification number: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  C08L75/04

Abstract: A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.