公开(公告)号：US11442362B2

公开(公告)日：2022-09-13

申请号：US16669379

申请日：2019-10-30

Applicant: California Institute of Technology

Inventor： Andrey Vyatskikh ,  Stephane J. Delalande ,  Julia R. Greer

IPC: G03F7/004 ,  G03F7/40 ,  G03F7/20 ,  G03F7/00 ,  G03F7/027 ,  B33Y10/00

Abstract: This disclosure provides a scalable and reproducible process to create complex 3D metal materials with sub-micron features by applying lithographic methods to transparent metal- or inorganic-rich polymer resins.

公开(公告)号：US20200073236A1

公开(公告)日：2020-03-05

申请号：US16669379

申请日：2019-10-30

Applicant: California Institute of Technology

Inventor： Andrey Vyatskikh ,  Stephane J. Delalande ,  Julia R. Greer

IPC: G03F7/004 ,  G03F7/20 ,  G03F7/40 ,  G03F7/027 ,  G03F7/00

Abstract: This disclosure provides a scalable and reproducible process to create complex 3D metal materials with sub-micron features by applying lithographic methods to transparent metal- or inorganic-rich polymer resins.

公开(公告)号：US20180088462A1

公开(公告)日：2018-03-29

申请号：US15719338

申请日：2017-09-28

Applicant: California Institute of Technology

Inventor： Andrey Vyatskikh ,  Stephane J. Delalande ,  Julia R. Greer

IPC: G03F7/004 ,  G03F7/20 ,  G03F7/40 ,  B33Y10/00

CPC classification number: G03F7/0042 ,  B33Y10/00 ,  G03F7/0037 ,  G03F7/0043 ,  G03F7/027 ,  G03F7/2053 ,  G03F7/40

Abstract: This disclosure provides a scalable and reproducible process to create complex 3D metal materials with sub-micron features by applying lithographic methods to transparent metal- or inorganic-rich polymer resins.