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公开(公告)号:US20230196189A1
公开(公告)日:2023-06-22
申请号:US17701054
申请日:2022-03-22
申请人: Carl Zeiss SMT GmbH
发明人: Alexander Freytag , Oliver Malki , Johannes Persch , Thomas Korb , Jens Timo Neumann , Amir Avishai , Alex Buxbaum , Eugen Foca , Dmitry Klochkov
IPC分类号: G06N20/00
CPC分类号: G06N20/00
摘要: A system and a method for measuring of parameter values of semiconductor objects within wafers with increased throughput include using a modified machine learning algorithm to extract measurement results from instances of semiconductor objects. A training method for training the modified machine learning algorithm includes reducing a user interaction. The method can be more flexible and robust and can involve less user interaction than conventional methods. The system and method can be used for quantitative metrology of integrated circuits within semiconductor wafers.
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公开(公告)号:US20240311698A1
公开(公告)日:2024-09-19
申请号:US18673373
申请日:2024-05-24
申请人: Carl Zeiss SMT GmbH
发明人: Alexander Freytag , Oliver Malki , Johannes Persch , Thomas Korb , Jens Timo Neumann , Amir Avishai , Alex Buxbaum , Eugen Foca , Dmitry Klochkov
IPC分类号: G06N20/00 , G01N23/2251
CPC分类号: G06N20/00 , G01N23/2251 , G01N2223/401 , G01N2223/6116
摘要: A system and a method for measuring of parameter values of semiconductor objects within wafers with increased throughput include using a modified machine learning algorithm to extract measurement results from instances of semiconductor objects. A training method for training the modified machine learning algorithm includes reducing a user interaction. The method can be more flexible and robust and can involve less user interaction than conventional methods. The system and method can be used for quantitative metrology of integrated circuits within semiconductor wafers.
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公开(公告)号:US20240087134A1
公开(公告)日:2024-03-14
申请号:US18487844
申请日:2023-10-16
申请人: Carl Zeiss SMT GmbH
发明人: Dmitry Klochkov , Jens Timo Neumann , Thomas Korb , Eno Töppe , Johannes Persch , Abhilash Srikantha , Alexander Freytag
CPC分类号: G06T7/149 , G06T7/0004 , G06T2207/10028 , G06T2207/10061 , G06T2207/10072 , G06T2207/30148
摘要: A method identifies ring structures in pillars of high aspect ratio (HAR) structures. For segmentation of rings, a machine learning-logic is used. A two-step training method for the machine learning logic is described.
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