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    ILLUMINATION SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS
    6.
    发明申请
    ILLUMINATION SYSTEM OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS 有权
    微波投影曝光装置的照明系统

    公开(公告)号：US20150146183A1

    公开(公告)日：2015-05-28

    申请号：US14543079

    申请日：2014-11-17

    申请人： Carl Zeiss SMT GmbH

    发明人： Markus Deguenther ,  Vladimir Davydenko ,  Thomas Korb ,  Frank Schlesener ,  Stefanie Hilt ,  Wolfgang Hoegele

    IPC分类号： G03F7/20 ,  G02B26/08

    CPC分类号： G03F7/70058 ,  G02B26/0833 ,  G03F7/70066 ,  G03F7/70075 ,  G03F7/70116 ,  G03F7/70191 ,  G03F7/70425

    摘要： An illumination system of a microlithographic projection exposure apparatus includes an optical integrator having a plurality of light entrance facets each being associated with a secondary light source. A spatial light modulator has a light exit surface and transmit or to reflect impinging projection light in a spatially resolved manner. A pupil forming unit directs projection light on the spatial light modulator. An objective images the light exit surface of the spatial light modulator onto the light entrance facets of the optical integrator. The light exit surface of the optical light modulator includes groups of object areas being separated by areas that are not imaged on the light entrance facets. The objective combines images of the object areas so that the images of the object areas abut on the optical integrator.

    摘要翻译： 微光刻投影曝光装置的照明系统包括具有多个光入射面的光学积分器，每个光入射面与二次光源相关联。 空间光调制器具有光出射表面，并以空间分辨的方式透射或反射入射的投影光。 瞳孔形成单元将投射光引导到空间光调制器上。 目标将空间光调制器的光出射表面成像到光学积分器的光入射面上。 光学调制器的光出射表面包括由未在光入射面上成像的区域分离的物体区域组。 该目的将物体区域的图像合并，使得物体区域的图像抵接在光学积分器上。

    OPTICAL SYSTEM FOR A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS AND MICROLITHOGRAPHIC EXPOSURE METHOD
    7.
    发明申请
    OPTICAL SYSTEM FOR A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS AND MICROLITHOGRAPHIC EXPOSURE METHOD 有权
    微观投影曝光装置和微观曝光方法的光学系统

    公开(公告)号：US20130077077A1

    公开(公告)日：2013-03-28

    申请号：US13660146

    申请日：2012-10-25

    申请人： CARL ZEISS SMT GMBH

    发明人： Ingo Saenger ,  Ralf Scharnweber ,  Olaf Dittmann ,  Toralf Gruner ,  Gundula Weiss ,  Andras G. Major ,  Martin Vogt ,  Markus Deguenther ,  Johannes Wangler ,  Thomas Korb

    IPC分类号： G03B27/72 ,  G02B27/28

    CPC分类号： G03F7/70116 ,  G03F7/70566

    摘要： An optical system for a microlithographic projection exposure apparatus and a microlithographic exposure method are disclosed. In an embodiment an optical system for a microlithographic projection exposure apparatus includes at least one mirror arrangement having a plurality of mirror elements which are displaceable independently of each other for altering an angular distribution of the light reflected by the mirror arrangement. The optical system also includes at least one manipulator downstream of the mirror arrangement in the light propagation direction. The manipulator has a raster arrangement of manipulator elements so that light incident on the manipulator during operation of the optical system is influenced differently in its polarization state and/or in its intensity in dependence on the incidence location.

    摘要翻译： 公开了一种用于微光刻投影曝光装置和微光刻曝光方法的光学系统。 在一个实施例中，用于微光刻投影曝光装置的光学系统包括至少一个具有多个镜元件的反射镜装置，该多个反射镜装置可彼此独立地移位，以改变由反射镜装置反射的光的角分布。 光学系统还包括在光传播方向上的反射镜装置下游的至少一个操纵器。 操纵器具有操纵器元件的光栅布置，使得在光学系统的操作期间入射到机械手上的光在其偏振状态和/或其强度方面根据入射位置受到不同的影响。

    CONTACT AREA SIZE DETERMINATION BETWEEN 3D STRUCTURES IN AN INTEGRATED SEMICONDUCTOR SAMPLE
    9.
    发明申请
    CONTACT AREA SIZE DETERMINATION BETWEEN 3D STRUCTURES IN AN INTEGRATED SEMICONDUCTOR SAMPLE 有权

    公开(公告)号：US20220230899A1

    公开(公告)日：2022-07-21

    申请号：US17713645

    申请日：2022-04-05

    申请人： Carl Zeiss SMT GmbH

    发明人： Alex Buxbaum ,  Amir Avishai ,  Dmitry Klochkov ,  Thomas Korb ,  Eugen Foca ,  Keumsil Lee

    IPC分类号： H01L21/67 ,  G06T17/00 ,  G06T7/00 ,  G06T7/13 ,  G06T7/73 ,  G06T7/55 ,  G06T7/33

    摘要： A method of determining a size of a contact area between a first 3D structure and a second 3D structure in an integrated semiconductor sample, includes the following steps: obtaining at least a first cross section image and a second cross section image parallel to the first cross section image, wherein obtaining the first and second cross section images includes subsequently removing a cross section surface layer of the integrated semiconductor sample using a focused ion beam to make a new cross section accessible for imaging, and imaging the new cross section of the integrated semiconductor sample with an imaging device; performing image registration of the obtained cross section images and obtaining a 3D data set; determining a 3D model representing the first 3D structure and the second 3D structure in the 3D data set; and determining a relative overlap of the first 3D structure with the second 3D structure based on the 3D model.

    Multi-scanning electron microscopy for wafer alignment
    10.
    发明授权
    Multi-scanning electron microscopy for wafer alignment 有权

    公开(公告)号：US10901391B1

    公开(公告)日：2021-01-26

    申请号：US16564453

    申请日：2019-09-09

    申请人： Carl Zeiss SMT GmbH

    发明人： Jagdish Chandra Saraswatula ,  Jens Timo Neumann ,  Philipp Huethwohl ,  Thomas Korb ,  Raghavendra Hanumantha Nayak

    IPC分类号： G05B19/402 ,  H01L23/544 ,  G06T7/00

    摘要： A method includes controlling a multi-scanning electron microscope, mSEM, to capture a first image of a wafer attached to a motorized handling stage while the motorized handling stage is in a first position. The first image includes at least a part of a notch of the wafer. The method also includes determining a radial axis of the wafer based on the first image, and controlling the motorized handling stage to shift the wafer along the radial axis by half a diameter of the wafer so that the motorized handling stage is in a second position. The method further includes controlling the mSEM to capture a second image of the wafer while the motorized handling stage is in the second position. The second image includes wafer structures. In addition, the method includes determining a reference position of the wafer based on a structure recognition of the wafer structures of the second image, and registering a wafer coordinate system of the wafer to a stage coordinate system of the motorized handling stage based on the reference position and the radial axis.