公开(公告)号：US09395411B2

公开(公告)日：2016-07-19

申请号：US13953545

申请日：2013-07-29

Applicant: Cascade Microtech, Inc.

Inventor： Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

IPC: G01R31/00 ,  G01R31/28

CPC classification number: G01R31/2891 ,  G01R31/2874

Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

公开(公告)号：US20140028337A1

公开(公告)日：2014-01-30

申请号：US13953545

申请日：2013-07-29

Applicant: Cascade Microtech, Inc.

Inventor： Joerg Kiesewetter ,  Stojan Kanev ,  Michael Teich ,  Karsten Stoll ,  Axel Schmidt

IPC: G01R31/28

CPC classification number: G01R31/2891 ,  G01R31/2874

Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

Abstract translation: 在用于在限定的热条件下测试测试基板的方法和装置中，待测试的基板由温度可控的卡盘保持并设定在限定的温度; 测试基板通过至少一个定位装置相对于测试探针定位; 并且测试探针与测试基板接触以进行测试。 存在于受温度控制的测试基板附近的定位装置的至少一个部件通过温度控制装置设定为与测试基板的温度无关的温度，并且该温度保持恒定。