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公开(公告)号:US10180486B2
公开(公告)日:2019-01-15
申请号:US15072204
申请日:2016-03-16
Applicant: Cascade Microtech, Inc.
Inventor: Daniel M. Bock , Samantha Nhim , Lynh Thuy Bui
IPC: G01R35/00 , G01R1/067 , G01R31/28 , G01R31/319 , H01L21/66
Abstract: Test standards and methods for impedance calibration of a probe system and probe systems that include the test standards and/or utilize the methods are disclosed herein. The test standards include at least one test structure. In some embodiments, the test standard further includes an alignment structure that is associated with the test structure. In some embodiments, the test standards include a plurality of test structures. In some embodiments, the plurality of test structures includes a thin film thru test structure and a thin film offset test structure. In some embodiments, the plurality of test structures is positioned to simultaneously contact a plurality of probe regions of a probe head. The methods include methods of calibrating a probe system.
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公开(公告)号:US20170269183A1
公开(公告)日:2017-09-21
申请号:US15072204
申请日:2016-03-16
Applicant: Cascade Microtech, Inc.
Inventor: Daniel M. Bock , Samantha Nhim , Lynh Thuy Bui
CPC classification number: G01R35/005 , G01R1/067 , G01R31/2886 , G01R31/3191 , G01R35/007 , H01L22/34
Abstract: Test standards and methods for impedance calibration of a probe system and probe systems that include the test standards and/or utilize the methods are disclosed herein. The test standards include at least one test structure. In some embodiments, the test standard further includes an alignment structure that is associated with the test structure. In some embodiments, the test standards include a plurality of test structures. In some embodiments, the plurality of test structures includes a thin film thru test structure and a thin film offset test structure. In some embodiments, the plurality of test structures is positioned to simultaneously contact a plurality of probe regions of a probe head. The methods include methods of calibrating a probe system.
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