公开(公告)号：US20170330815A1

公开(公告)日：2017-11-16

申请号：US15156169

申请日：2016-05-16

Applicant: Caterpillar Inc.

Inventor： William Mische ,  Eric Andris ,  Basheer Qattum ,  Daniel Sergison

IPC: H01L23/367 ,  H02M1/08 ,  H01L29/739 ,  H01L25/07 ,  H05K5/03 ,  H01L23/40

CPC classification number: H01L23/3675 ,  H01L23/4006 ,  H01L25/072 ,  H01L2023/4087 ,  H05K7/1432

Abstract: A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom surface of the sidewall portion such that the housing support plate and the sidewall portion define an interior space of the housing of the semiconductor module, and a semiconductor device disposed within the interior space and fixedly coupled to the housing. The semiconductor module may further include a cover member fixedly attached to a top surface of the sidewall portion such that the cover member, the housing and the housing support plate form a protective enclosure for the semiconductor device.

公开(公告)号：US20240348154A1

公开(公告)日：2024-10-17

申请号：US18134099

申请日：2023-04-13

Applicant: Caterpillar Inc.

Inventor： Basheer Qattum ,  Dachuan Yu

IPC: H02M1/32 ,  H02M1/44 ,  H02M7/537

CPC classification number: H02M1/32 ,  H02M1/44 ,  H02M7/537

Abstract: Techniques that eliminate the need for a dedicated pre-charge resistor by using the main power path of the AC/DC, DC/DC, or DC/AC converter. By eliminating the pre-charge resistor, the techniques increase the maximum allowable current rating of the converter as well as increase the impedance and inductance of the converter.

公开(公告)号：US09824953B1

公开(公告)日：2017-11-21

申请号：US15156169

申请日：2016-05-16

Applicant: Caterpillar Inc.

Inventor： William Mische ,  Eric Andris ,  Basheer Qattum ,  Daniel Sergison

IPC: H01L23/367 ,  H01L29/739 ,  H01L23/40 ,  H01L25/07 ,  H02M1/08 ,  H05K5/03

CPC classification number: H01L23/3675 ,  H01L23/4006 ,  H01L25/072 ,  H01L2023/4087 ,  H05K7/1432

Abstract: A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom surface of the sidewall portion such that the housing support plate and the sidewall portion define an interior space of the housing of the semiconductor module, and a semiconductor device disposed within the interior space and fixedly coupled to the housing. The semiconductor module may further include a cover member fixedly attached to a top surface of the sidewall portion such that the cover member, the housing and the housing support plate form a protective enclosure for the semiconductor device.