公开(公告)号：US20070235213A1

公开(公告)日：2007-10-11

申请号：US11524378

申请日：2006-09-21

申请人： Chang Ik Lee ,  Jun Cheol Dark ,  Dong Ryun Mok

发明人： Chang Ik Lee ,  Jun Cheol Dark ,  Dong Ryun Mok

IPC分类号： H05K1/03

CPC分类号： H05K1/0218 ,  H05K1/0253 ,  H05K2201/0191 ,  H05K2201/0323 ,  H05K2201/0715

摘要： The present invention relates to a 2-layer printed circuit board (PCB) for enabling impedance matching of a high frequency signal line, and a method of manufacturing the 2-layer PCB. In the present invention, an insulation layer with a predetermined thickness is formed as an insulation substance on a top surface of a signal layer formed on a general 2-layer PCB so as to protect a high frequency signal line formed on the signal layer. An auxiliary layer selectively including carbon, a PCB, a tape in the form of copper foil or the like is formed on a top surface of the insulation layer. At this time, the thickness of the insulation layer is determined to be different depending on a material of the auxiliary layer. Further, the auxiliary layer and a ground layer provided to the 2-layer PCB are electrically connected to each other. Then, the auxiliary layer serves as a ground plane. Accordingly, the present invention has an advantage in that impedance matching of a high frequency signal line is possible even in a PCB having a 2-layer structure and the manufacturing costs of a PCB can be reduced by simplifying a laminated structure.

摘要翻译： 本发明涉及一种用于实现高频信号线的阻抗匹配的2层印刷电路板（PCB）和制造该2层PCB的方法。 在本发明中，在形成在通常的2层PCB上的信号层的上表面上形成具有预定厚度的绝缘层作为绝缘物质，以保护形成在信号层上的高频信号线。 在绝缘层的顶表面上形成选择性地包括碳，PCB，铜箔等的带的辅助层。 此时，根据辅助层的材料，绝缘层的厚度被确定为不同。 此外，设置在2层PCB上的辅助层和接地层彼此电连接。 然后，辅助层用作接地平面。 因此，本发明的优点在于，即使在具有2层结构的PCB中，高频信号线的阻抗匹配也是可能的，并且通过简化叠层结构可以降低PCB的制造成本。