公开(公告)号：US20230294189A1

公开(公告)日：2023-09-21

申请号：US17733109

申请日：2022-04-29

Applicant: Changsha University of Science and Technology

Inventor： Cong MAO ,  Weidong TANG ,  Yuanqiang LUO ,  Yinghui REN ,  Wei LI ,  Mingjun ZHANG ,  Kun TANG ,  Gang WU ,  Yongle HU ,  Feng SHI ,  Ziyang CHEN ,  Zhuo WEN

IPC: B23H9/02 ,  B23H3/02 ,  B23H3/08

CPC classification number: B23H9/02 ,  B23H3/02 ,  B23H3/08 ,  B23H2300/10

Abstract: This paper describes an invention involving an electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials. The specific machining method is described below. A micro-grinding tool and an auxiliary electrode are respectively connected to the negative and positive electrodes of a pulsed DC power supply. When the current flows through the loop, an electrochemical hydrogen evolution reaction (HER) occurs at the micro-grinding tool in the grinding fluid, which generate multiple hydrogen bubbles. The bubbles coalesce into an insulating gas film and separate the micro-grinding tool from the grinding fluid; when the critical voltage is reached, the gas film is broken down and an electrochemical discharge occurs accompanied by discharge spark; under the action of the discharge spark, the surface material of the workpiece in the discharge-affected region is directly ablated to generate a heat-affected layer (HAL), namely, physical modification.