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公开(公告)号：US09807516B2
公开(公告)日：2017-10-31
申请号：US14832913
申请日：2015-08-21
CPC classification number: H04R19/04 , B81B7/0064 , B81B2201/0257 , B81B2207/012 , H04R19/005 , H04R2201/003 , H04R2209/022
Abstract: A micro-electro-mechanical system (MEMS) microphone package is provided in the present disclosure. The MEMS microphone package includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a shielding ring covering a joint between the electromagnetic shielding cover and the circuit board. The shielding ring is configured for preventing electromagnetic waves from entering the accommodating space via the joint between the electromagnetic shielding cover and the circuit board.
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公开(公告)号：US20130294632A1
公开(公告)日：2013-11-07
申请号：US13751507
申请日：2013-01-28
IPC: H04R1/28
CPC classification number: H04R1/2811 , H04R7/04 , H04R7/045 , H04R7/10 , H04R2440/05
Abstract: Disclosed is a panel-form loudspeaker. The panel-form loudspeaker includes a resonant mode sound radiating panel, a case with a vibrating plate attached on the sound radiating panel, and a number of transducers separated from each other for forming a vibration and connected with the vibrating plate for transferring the vibration to the vibrating plate to cause the sound radiating panel to resonate and radiate an acoustic output. The vibrating plate has a number of vibrating portions mounting on the sound radiating panel and spaced from each other for fixing the transducers and a number of bending portions extending from the vibrating portions away from the sound radiating panel.
Abstract translation: 公开了一种面板式扬声器。 面板式扬声器包括谐振模式声辐射面板，安装在声辐射面板上的振动板的壳体和多个彼此分离的换能器，用于形成振动并与振动板连接以将振动传递到 振动板使声辐射面板共振并辐射声输出。 所述振动板具有安装在所述声辐射面板上的多个振动部，并且彼此隔开以固定所述换能器，以及从所述振动部分延伸远离所述声辐射面板的多个弯曲部。
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公开(公告)号：US20160219376A1
公开(公告)日：2016-07-28
申请号：US14832913
申请日：2015-08-21
CPC classification number: H04R19/04 , B81B7/0064 , B81B2201/0257 , B81B2207/012 , H04R19/005 , H04R2201/003 , H04R2209/022
Abstract: A micro-electro-mechanical system (MEMS) microphone package is provided in the present disclosure. The MEMS microphone package includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a shielding ring covering a joint between the electromagnetic shielding cover and the circuit board. The shielding ring is configured for preventing electromagnetic waves from entering the accommodating space via the joint between the electromagnetic shielding cover and the circuit board.
Abstract translation: 在本公开中提供了微机电系统（MEMS）麦克风封装。 MEMS麦克风封装包括电路板，安装在电路板上以限定容纳空间的电磁屏蔽盖，容纳在容纳空间中并电连接到电路板的电子元件，以及覆盖电磁屏蔽 盖板和电路板。 遮蔽环被构造成用于防止电磁波经由电磁屏蔽盖和电路板之间的接合进入容纳空间。
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公开(公告)号：US20230219284A1
公开(公告)日：2023-07-13
申请号：US18154257
申请日：2023-01-13
Applicant: Chao Wang , Shinhyuk Choi , Yu Yao , Jiawei Zuo
Inventor： Chao Wang , Shinhyuk Choi , Yu Yao , Jiawei Zuo
IPC: B29C64/106 , B33Y10/00 , B33Y70/10 , B29C35/08
CPC classification number: B29C64/106 , B33Y10/00 , B33Y70/10 , B29C35/0805 , B29C2035/0827
Abstract: A structural color image includes a metallic layer, a nanocomposite film, and a dielectric layer between and in direct contact with the metallic layer and the nanocomposite film. The metallic layer reflects visible light. The nanocomposite film reflects visible light and includes metallic nanoparticles in a polymeric material.
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Patent Agency Ranking
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公开(公告)号：US11135649B2
公开(公告)日：2021-10-05
申请号：US16286006
申请日：2019-02-26
Abstract: An additive manufacturing process for forming a metallic layer on the surface of the substrate includes fabricating a substrate from a polymerizable composition by a stereolithographic process, and contacting the reactive surface with an aqueous solution including a metal precursor. The metal precursor includes a metal, and the polymerizable composition includes a multiplicity of multifunctional components. Each multifunctional component includes a reactive moiety extending from a surface of the substrate to form a reactive surface. An interface between the reactive surface and the aqueous solution is irradiated to form nanoparticles including the metal. The nanoparticles are chemically coupled to the reactive surface by reactive moieties, thereby forming a metallic layer on the surface of the substrate.
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公开(公告)号：USD913858S1
公开(公告)日：2021-03-23
申请号：US29715309
申请日：2019-11-30
Applicant: Chao Wang , Kun Lang , Lei Cao , Yongqiang Liu
Designer： Chao Wang , Kun Lang , Lei Cao , Yongqiang Liu
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公开(公告)号：US20190262897A1
公开(公告)日：2019-08-29
申请号：US16286006
申请日：2019-02-26
Abstract: An additive manufacturing process for forming a metallic layer on the surface of the substrate includes fabricating a substrate from a polymerizable composition by a stereolithographic process, and contacting the reactive surface with an aqueous solution including a metal precursor. The metal precursor includes a metal, and the polymerizable composition includes a multiplicity of multifunctional components. Each multifunctional component includes a reactive moiety extending from a surface of the substrate to form a reactive surface. An interface between the reactive surface and the aqueous solution is irradiated to form nanoparticles including the metal. The nanoparticles are chemically coupled to the reactive surface by reactive moieties, thereby forming a metallic layer on the surface of the substrate.
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公开(公告)号：US09859608B2
公开(公告)日：2018-01-02
申请号：US15008641
申请日：2016-01-28
Applicant: Chao Wang , Jianchun Mai
Inventor： Chao Wang , Jianchun Mai
CPC classification number: H01Q1/243 , H01Q5/371 , H01Q9/0421
Abstract: An antenna module applicable to a mobile device is provided in the present disclosure. The antenna module includes a metal frame, a circuit board surrounded by the metal frame, and an antenna portion on the circuit board. The circuit board includes a main board and a ground board placed on the main board. The antenna portion includes at least one low frequency (LF) ground point and at least one high frequency (HF) ground point arranged on the ground board, and a feed point arranged on the main board. The at least one LF ground point and the at least one HF ground point contact the metal frame; a first current path length between the feed point and the at least one LF ground point is greater than a second current path length between the feed point and the at least one HF ground point.
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