Antenna system
    1.
    发明授权

    公开(公告)号:US10230162B2

    公开(公告)日:2019-03-12

    申请号:US15417199

    申请日:2017-01-26

    摘要: Provided is an antenna system, including a system ground unit, a metal back cover, a frame as antenna radiator, and a grounding circuit, a feeding circuit and a tuning switch, the antenna radiator includes a main radiator and an auxiliary radiator; the main radiator includes a first main radiator which forms, together with the metal back cover, a first main gap, a second main radiator extending from the first main radiator and forms, together with the metal back cover, a second main gap, and a first fracture separating the first main radiator into two parts; the auxiliary radiator includes a first auxiliary radiator which forms, together with the metal back cover, a first auxiliary gap, a second auxiliary radiator extending from the first auxiliary radiator and forms, together with the metal back cover, a second auxiliary gap, and a second fracture separating the first auxiliary radiator into two parts.

    ANTENNA ASSEMBLY AND MOBILE TERMINAL USING SAME
    2.
    发明申请
    ANTENNA ASSEMBLY AND MOBILE TERMINAL USING SAME 有权
    天线组装和移动终端使用相同

    公开(公告)号:US20140347229A1

    公开(公告)日:2014-11-27

    申请号:US14280838

    申请日:2014-05-19

    申请人: Yongli Chen Chao Wang

    发明人: Yongli Chen Chao Wang

    IPC分类号: H01Q1/24 H01Q1/50

    CPC分类号: H01Q1/243 H01Q5/371 H01Q9/42

    摘要: An antenna assembly is disclosed. The antenna assembly includes a radiation body, an antenna feed portion, a RF feed portion, a first branch having one end electrically connecting to the antenna feed portion, and another end electrically connects to a first feed point of the radiation body, the first feed point dividing the radiation body into a first radiation portion and a second radiation portion. The antenna assembly further includes a second branch electrically connecting to a second feed point of the second radiation portion, an impedance matching circuit coupled between the antenna feed portion and the RF feed portion. The impedance matching circuit receives the low frequency signals and matches the impedance, then feeds to the antenna feed portion.

    摘要翻译: 公开了一种天线组件。 天线组件包括辐射体,天线馈电部分,RF馈送部分,第一分支,其一端电连接到天线馈电部分,另一端电连接到辐射体的第一馈电点,第一馈电 将辐射体分成第一辐射部分和第二辐射部分。 天线组件还包括电连接到第二辐射部分的第二馈电点的第二支路,耦合在天线馈电部分和RF馈电部分之间的阻抗匹配电路。 阻抗匹配电路接收低频信号并匹配阻抗,然后馈送到天线馈电部分。

    Antenna and electronic device using same
    3.
    发明授权
    Antenna and electronic device using same 有权
    天线和电子设备使用相同

    公开(公告)号:US09466874B2

    公开(公告)日:2016-10-11

    申请号:US14269296

    申请日:2014-05-05

    申请人: Chao Wang Yongli Chen

    发明人: Chao Wang Yongli Chen

    IPC分类号: H01Q1/24 H01Q9/04 H01Q5/371

    摘要: The present disclosure provides an antenna and an electronic device using same. The antenna includes an antenna radiating element for radiating signals, a capacitive feed plate separated from and substantially parallel to the antenna radiating element for carrying out capacitive feed on the antenna radiating element, and a FPC antenna electrically connecting with the capacitive feed plate for feeding for the capacitive feed plate. The FPC antenna includes a plate-shaped main body, a feeding end, a ground end, an extending portion for being electrically connected with the capacitive feed plate, and a feeding strip extending vertically from the extending portion for improving the low-frequency performance of the antenna.

    摘要翻译: 本公开提供了一种使用其的天线和电子设备。 天线包括用于辐射信号的天线辐射元件,与天线辐射元件分离并基本上平行于天线辐射元件进行电容馈电的电容馈电板,以及与电容馈电板电连接的FPC天线,用于馈送 电容馈电板。 FPC天线包括板状主体,​​馈电端,接地端,用于与电容馈电板电连接的延伸部分,以及从延伸部分垂直延伸的馈送条,用于改善低频性能 天线。

    Antenna System
    4.
    发明申请
    Antenna System 审中-公开

    公开(公告)号:US20180123234A1

    公开(公告)日:2018-05-03

    申请号:US15417199

    申请日:2017-01-26

    IPC分类号: H01Q1/48 H01Q1/22

    摘要: Provided is an antenna system, including a system ground unit, a metal back cover, a frame as antenna radiator, and a grounding circuit, a feeding circuit and a tuning switch, the antenna radiator includes a main radiator and an auxiliary radiator; the main radiator includes a first main radiator which forms, together with the metal back cover, a first main gap, a second main radiator extending from the first main radiator and forms, together with the metal back cover, a second main gap, and a first fracture separating the first main radiator into two parts; the auxiliary radiator includes a first auxiliary radiator which forms, together with the metal back cover, a first auxiliary gap, a second auxiliary radiator extending from the first auxiliary radiator and forms, together with the metal back cover, a second auxiliary gap, and a second fracture separating the first auxiliary radiator into two parts.

    Antenna assembly and mobile terminal using same
    5.
    发明授权
    Antenna assembly and mobile terminal using same 有权
    天线组件和移动终端使用相同

    公开(公告)号:US09509040B2

    公开(公告)日:2016-11-29

    申请号:US14280838

    申请日:2014-05-19

    申请人: Yongli Chen Chao Wang

    发明人: Yongli Chen Chao Wang

    IPC分类号: H01Q1/24 H01Q9/42 H01Q5/371

    CPC分类号: H01Q1/243 H01Q5/371 H01Q9/42

    摘要: An antenna assembly is disclosed. The antenna assembly includes a radiation body, an antenna feed portion, a RF feed portion, a first branch having one end electrically connecting to the antenna feed portion, and another end electrically connects to a first feed point of the radiation body, the first feed point dividing the radiation body into a first radiation portion and a second radiation portion. The antenna assembly further includes a second branch electrically connecting to a second feed point of the second radiation portion, an impedance matching circuit coupled between the antenna feed portion and the RF feed portion. The impedance matching circuit receives the low frequency signals and matches the impedance, then feeds to the antenna feed portion.

    摘要翻译: 公开了一种天线组件。 天线组件包括辐射体,天线馈电部分,RF馈送部分,第一分支,其一端电连接到天线馈电部分,另一端电连接到辐射体的第一馈电点,第一馈电 将辐射体分成第一辐射部分和第二辐射部分。 天线组件还包括电连接到第二辐射部分的第二馈电点的第二支路,耦合在天线馈电部分和RF馈电部分之间的阻抗匹配电路。 阻抗匹配电路接收低频信号并匹配阻抗,然后馈送到天线馈电部分。

    ANTENNA AND ELECTRONIC DEVICE USING SAME
    6.
    发明申请
    ANTENNA AND ELECTRONIC DEVICE USING SAME 有权
    天线和电子设备使用相同

    公开(公告)号:US20140333488A1

    公开(公告)日:2014-11-13

    申请号:US14269296

    申请日:2014-05-05

    申请人: Chao Wang Yongli Chen

    发明人: Chao Wang Yongli Chen

    IPC分类号: H01Q1/24 H01Q1/36

    摘要: The present disclosure provides an antenna and an electronic device using same. The antenna includes an antenna radiating element for radiating signals, a capacitive feed plate separated from and substantially parallel to the antenna radiating element for carrying out capacitive feed on the antenna radiating element, and a FPC antenna electrically connecting with the capacitive feed plate for feeding for the capacitive feed plate. The FPC antenna includes a plate-shaped main body, a feeding end, a ground end, an extending portion for being electrically connected with the capacitive feed plate, and a feeding strip extending vertically from the extending portion for improving the low-frequency performance of the antenna.

    摘要翻译: 本公开提供了一种使用其的天线和电子设备。 天线包括用于辐射信号的天线辐射元件,与天线辐射元件分离并基本上平行于天线辐射元件进行电容馈电的电容馈电板,以及与电容馈电板电连接的FPC天线,用于馈送 电容馈电板。 FPC天线包括板状主体,​​馈电端,接地端,用于与电容馈电板电连接的延伸部分,以及从延伸部分垂直延伸的馈送条,用于改善低频性能 天线。

    Direct metal printing with stereolithography

    公开(公告)号:US11135649B2

    公开(公告)日:2021-10-05

    申请号:US16286006

    申请日:2019-02-26

    摘要: An additive manufacturing process for forming a metallic layer on the surface of the substrate includes fabricating a substrate from a polymerizable composition by a stereolithographic process, and contacting the reactive surface with an aqueous solution including a metal precursor. The metal precursor includes a metal, and the polymerizable composition includes a multiplicity of multifunctional components. Each multifunctional component includes a reactive moiety extending from a surface of the substrate to form a reactive surface. An interface between the reactive surface and the aqueous solution is irradiated to form nanoparticles including the metal. The nanoparticles are chemically coupled to the reactive surface by reactive moieties, thereby forming a metallic layer on the surface of the substrate.