摘要:
A multi-chip processor apparatus includes multiple processor chips on a substrate. At least one of the multiple processor chips includes a die with a primary interconnect trunk that communicates information between multiple compute elements situated along the primary interconnect trunk. That multiple processor chip includes a secondary interconnected trunk that may be oriented perpendicular with respect to the primary interconnect trunk. The secondary interconnect trunk communicates information off-chip via a number of I/O interfaces at the perimeter of that multiple processor chip. The secondary interconnect trunk intersects the primary interconnect trunk at an intersection at which a bus control element is located. The bus control element includes a primary trunk interface that couples to the primary interconnect trunk at the intersection to enable the bus control element to control on-chip communication among the compute elements via coherency signals on the primary interconnect trunk. The bus control element includes a secondary trunk interface coupled to the secondary interconnect trunk.
摘要:
A symmetric multi-processing (SMP) processor includes a primary interconnect trunk for communication of information between multiple compute elements situated along the primary interconnect trunk. The processor also includes a secondary interconnected trunk that may be oriented perpendicular with respect to the primary interconnect trunk. The secondary interconnect trunk communicates information off-chip via a number of I/O interfaces at the perimeter of the processor chip. The I/O interfaces may be distributed uniformly along portions of the perimeter.
摘要翻译:对称多处理(SMP)处理器包括用于在沿着主互连干线位于多个计算单元之间进行信息通信的主互连干线。 处理器还包括可相对于主互连干线垂直定向的次级互连干线。 辅助互连中继线通过处理器芯片周边的多个I / O接口来传送芯片外的信息。 I / O接口可以沿周边的部分均匀分布。