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    Spray cooling system for extreme environments
    1.
    发明授权
    Spray cooling system for extreme environments 有权
    喷雾冷却系统适用于极端环境

    公开(公告)号：US07264042B1

    公开(公告)日：2007-09-04

    申请号：US11255456

    申请日：2005-10-24

    申请人： Charles L. Tilton ,  Chester L. Turner ,  William J. Beasley ,  Douglas W. Miller ,  William C. Gustafson

    发明人： Charles L. Tilton ,  Chester L. Turner ,  William J. Beasley ,  Douglas W. Miller ,  William C. Gustafson

    IPC分类号： F28D15/06

    CPC分类号： H01L23/345 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic components from the external environment, a spray unit within the enclosure for thermally managing one or more electronic devices, a pump unit fluidly connected to the spray unit, a heat exchanger unit fluidly connected to the pump, and a control valve fluidly connected between the heat exchanger unit and the pump. An independent chamber preferably houses a heater unit, a first power supply and a control unit, whereby the heater unit initially heats the coolant within the independent chamber to a minimum operating temperature prior to operation of the electronic components.

    摘要翻译： 用于极端环境的喷雾冷却系统，用于为电子设备提供所需的封闭环境，而不管外部环境条件如何。 用于极端环境的喷雾冷却系统包括将电子部件与外部环境隔离的外壳，用于热管理一个或多个电子设备的外壳内的喷雾单元，与喷射单元流体连接的泵单元，流体地连接到热交换器单元 连接到泵，以及流体连接在热交换器单元和泵之间的控制阀。 独立的室优选地容纳加热器单元，第一电源和控制单元，由此加热器单元在电子部件的操作之前最初将独立室内的冷却剂加热至最低工作温度。

    Method of operating a thermal management system
    2.
    发明授权
    Method of operating a thermal management system 有权
    操作热管理系统的方法

    公开(公告)号：US07216695B1

    公开(公告)日：2007-05-15

    申请号：US11255457

    申请日：2005-10-24

    申请人： Charles L. Tilton ,  Chester L. Turner ,  William J. Beasley ,  Douglas W. Miller ,  William C. Gustafson

    发明人： Charles L. Tilton ,  Chester L. Turner ,  William J. Beasley ,  Douglas W. Miller ,  William C. Gustafson

    IPC分类号： F28D15/06

    CPC分类号： H01L23/345 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic components from the external environment, a spray unit within the enclosure for thermally managing one or more electronic devices, a pump unit fluidly connected to the spray unit, a heat exchanger unit fluidly connected to the pump, and a control valve fluidly connected between the heat exchanger unit and the pump. An independent chamber preferably houses a heater unit, a first power supply and a control unit, whereby the heater unit initially heats the coolant within the independent chamber to a minimum operating temperature prior to operation of the electronic components.

    摘要翻译： 用于极端环境的喷雾冷却系统，用于为电子设备提供所需的封闭环境，而不管外部环境条件如何。 用于极端环境的喷雾冷却系统包括将电子部件与外部环境隔离的外壳，用于热管理一个或多个电子设备的外壳内的喷雾单元，与喷射单元流体连接的泵单元，流体地连接到热交换器单元 连接到泵，以及流体连接在热交换器单元和泵之间的控制阀。 独立的室优选地容纳加热器单元，第一电源和控制单元，由此加热器单元在电子部件的操作之前最初将独立室内的冷却剂加热至最低工作温度。

    Spray cooling system for extreme environments
    3.
    发明授权
    Spray cooling system for extreme environments 有权
    喷雾冷却系统适用于极端环境

    公开(公告)号：US06976528B1

    公开(公告)日：2005-12-20

    申请号：US10369321

    申请日：2003-02-18

    申请人： Charles L. Tilton ,  Douglas W. Miller ,  William C. Gustafson ,  William J. Beasley ,  Chester L. Turner

    发明人： Charles L. Tilton ,  Douglas W. Miller ,  William C. Gustafson ,  William J. Beasley ,  Chester L. Turner

    IPC分类号： F28D15/00 ,  H01L23/34 ,  H01L23/473

    CPC分类号： H01L23/345 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic components from the external environment, a spray unit within the enclosure for thermally managing one or more electronic devices, a pump unit fluidly connected to the spray unit, a heat exchanger unit fluidly connected to the pump, and a control valve fluidly connected between the heat exchanger unit and the pump. An independent chamber preferably houses a heater unit, a first power supply and a control unit, whereby the heater unit initially heats the coolant within the independent chamber to a minimum operating temperature prior to operation of the electronic components.

    摘要翻译： 用于极端环境的喷雾冷却系统，用于为电子设备提供所需的封闭环境，而不管外部环境条件如何。 用于极端环境的喷雾冷却系统包括将电子部件与外部环境隔离的外壳，用于热管理一个或多个电子设备的外壳内的喷雾单元，与喷射单元流体连接的泵单元，流体地连接到热交换器单元 连接到泵，以及流体连接在热交换器单元和泵之间的控制阀。 独立的室优选地容纳加热器单元，第一电源和控制单元，由此加热器单元在电子部件的操作之前最初将独立室内的冷却剂加热至最低工作温度。

    Narrow gap spray cooling in a globally cooled enclosure
    4.
    发明授权
    Narrow gap spray cooling in a globally cooled enclosure 有权
    在全球冷却的外壳中窄间隙喷雾冷却

    公开(公告)号：US07602608B2

    公开(公告)日：2009-10-13

    申请号：US11347898

    申请日：2006-02-06

    申请人： Charles L. Tilton ,  Donald E. Tilton ,  William J. Beasley ,  Douglas W. Miller ,  Randall T. Palmer

    发明人： Charles L. Tilton ,  Donald E. Tilton ,  William J. Beasley ,  Douglas W. Miller ,  Randall T. Palmer

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H05K7/20172 ,  H01L2924/00

    摘要： Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.

    摘要翻译： 电子电路板被布置为在其间限定窄间隙的相应的平行对。 一个或多个这样的板对被支撑在密封密封的壳体内并且通过将多个喷嘴中的雾化液体冷却剂喷射到每个窄间隙中而被冷却。 从电路板传递热量导致窄间隙内的至少一些雾化液体的蒸发。 壳体还用于引导蒸汽从每个窄间隙的循环，朝向喷嘴返回到每个窄间隙中。 热交换器从壳体和整个系统排出热量，其中蒸汽在与其接触和传热期间冷凝回液相。 收集冷凝液体并重新加压以将其输送回喷嘴，从而进行持续的冷却操作。

    Narrow gap spray cooling in a globally cooled enclosure
    5.
    发明授权
    Narrow gap spray cooling in a globally cooled enclosure 有权
    在全球冷却的外壳中窄间隙喷雾冷却

    公开(公告)号：US08174828B2

    公开(公告)日：2012-05-08

    申请号：US12541315

    申请日：2009-08-14

    申请人： Charles L Tilton ,  Donald E. Tilton ,  Randall T. Palmer ,  William J. Beasley ,  Douglas W. Miller ,  Norman O. Alder

    发明人： Charles L Tilton ,  Donald E. Tilton ,  Randall T. Palmer ,  William J. Beasley ,  Douglas W. Miller ,  Norman O. Alder

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20345 ,  H01L2924/00

    摘要： Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.

    摘要翻译： 电子电路板被布置为在其间限定窄间隙的相应的平行对。 一个或多个这样的板对被支撑在可密封的壳体内并且通过将多个喷嘴中的雾化的液体冷却剂喷射到每个窄间隙中而被冷却。 从电路板传递热量导致窄间隙内的至少一些雾化液体的蒸发。 壳体还用于引导蒸汽从每个窄间隙的循环，朝向喷嘴返回到每个窄间隙中。 热交换器从壳体和整个系统排出热量，其中蒸汽在与其接触和传热期间冷凝回液相。 收集冷凝液体并重新加压以将其输送回喷嘴，从而进行持续的冷却操作。

    Narrow Gap Spray Cooling in a Globally Cooled Enclosure
    7.
    发明申请
    Narrow Gap Spray Cooling in a Globally Cooled Enclosure 有权
    全球冷却外壳中的窄间隙喷雾冷却

    公开(公告)号：US20100039773A1

    公开(公告)日：2010-02-18

    申请号：US12541315

    申请日：2009-08-14

    申请人： Charles L. Tilton ,  Donald E. Tilton ,  Randall T. Palmer ,  William J. Beasley ,  Douglas W. Miller ,  Norman O. Alder

    发明人： Charles L. Tilton ,  Donald E. Tilton ,  Randall T. Palmer ,  William J. Beasley ,  Douglas W. Miller ,  Norman O. Alder

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20345 ,  H01L2924/00

    摘要： Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.

    摘要翻译： 电子电路板被布置为在其间限定窄间隙的相应的平行对。 一个或多个这样的板对被支撑在密封密封的壳体内并且通过将多个喷嘴中的雾化液体冷却剂喷射到每个窄间隙中而被冷却。 从电路板传递热量导致窄间隙内的至少一些雾化液体的蒸发。 壳体还用于引导蒸汽从每个窄间隙的循环，朝向喷嘴返回到每个窄间隙中。 热交换器从壳体和整个系统排出热量，其中蒸汽在与其接触和传热期间冷凝回液相。 收集冷凝液体并重新加压以将其输送回喷嘴，从而进行持续的冷却操作。