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公开(公告)号：US07602608B2
公开(公告)日：2009-10-13
申请号：US11347898
申请日：2006-02-06
申请人： Charles L. Tilton , Donald E. Tilton , William J. Beasley , Douglas W. Miller , Randall T. Palmer
发明人： Charles L. Tilton , Donald E. Tilton , William J. Beasley , Douglas W. Miller , Randall T. Palmer
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H05K7/20172 , H01L2924/00
摘要： Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.
摘要翻译： 电子电路板被布置为在其间限定窄间隙的相应的平行对。 一个或多个这样的板对被支撑在密封密封的壳体内并且通过将多个喷嘴中的雾化液体冷却剂喷射到每个窄间隙中而被冷却。 从电路板传递热量导致窄间隙内的至少一些雾化液体的蒸发。 壳体还用于引导蒸汽从每个窄间隙的循环，朝向喷嘴返回到每个窄间隙中。 热交换器从壳体和整个系统排出热量，其中蒸汽在与其接触和传热期间冷凝回液相。 收集冷凝液体并重新加压以将其输送回喷嘴，从而进行持续的冷却操作。
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公开(公告)号：US08174828B2
公开(公告)日：2012-05-08
申请号：US12541315
申请日：2009-08-14
申请人： Charles L Tilton , Donald E. Tilton , Randall T. Palmer , William J. Beasley , Douglas W. Miller , Norman O. Alder
发明人： Charles L Tilton , Donald E. Tilton , Randall T. Palmer , William J. Beasley , Douglas W. Miller , Norman O. Alder
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L23/427 , H01L2924/0002 , H05K7/20345 , H01L2924/00
摘要： Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.
摘要翻译： 电子电路板被布置为在其间限定窄间隙的相应的平行对。 一个或多个这样的板对被支撑在可密封的壳体内并且通过将多个喷嘴中的雾化的液体冷却剂喷射到每个窄间隙中而被冷却。 从电路板传递热量导致窄间隙内的至少一些雾化液体的蒸发。 壳体还用于引导蒸汽从每个窄间隙的循环，朝向喷嘴返回到每个窄间隙中。 热交换器从壳体和整个系统排出热量，其中蒸汽在与其接触和传热期间冷凝回液相。 收集冷凝液体并重新加压以将其输送回喷嘴，从而进行持续的冷却操作。
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公开(公告)号：US20100039773A1
公开(公告)日：2010-02-18
申请号：US12541315
申请日：2009-08-14
申请人： Charles L. Tilton , Donald E. Tilton , Randall T. Palmer , William J. Beasley , Douglas W. Miller , Norman O. Alder
发明人： Charles L. Tilton , Donald E. Tilton , Randall T. Palmer , William J. Beasley , Douglas W. Miller , Norman O. Alder
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L23/427 , H01L2924/0002 , H05K7/20345 , H01L2924/00
摘要： Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.
摘要翻译： 电子电路板被布置为在其间限定窄间隙的相应的平行对。 一个或多个这样的板对被支撑在密封密封的壳体内并且通过将多个喷嘴中的雾化液体冷却剂喷射到每个窄间隙中而被冷却。 从电路板传递热量导致窄间隙内的至少一些雾化液体的蒸发。 壳体还用于引导蒸汽从每个窄间隙的循环，朝向喷嘴返回到每个窄间隙中。 热交换器从壳体和整个系统排出热量，其中蒸汽在与其接触和传热期间冷凝回液相。 收集冷凝液体并重新加压以将其输送回喷嘴，从而进行持续的冷却操作。
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公开(公告)号：US07495914B2
公开(公告)日：2009-02-24
申请号：US11347897
申请日：2006-02-06
申请人： Charles L. Tilton , Donald E. Tilton , William J. Beasley , Douglas W. Miller , Randall T. Palmer
发明人： Charles L. Tilton , Donald E. Tilton , William J. Beasley , Douglas W. Miller , Randall T. Palmer
IPC分类号： H05K7/20
CPC分类号： H05K7/20345 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of nozzles into each narrow gap. Transfer of heat from the circuit boards results in vaporization of at least some of the atomized liquid within the narrow gap. The housing further serves to guide a circulation of vapors out of each narrow gap, back toward the nozzles, and back into each narrow gap. A heat exchanger exhausts heat from the housing and overall system, wherein vapor is condensed back to liquid phase during contact and heat transfer therewith. Condensed liquid is collected and re-pressurized for delivery back to the nozzles such that a sustained cooling operation is performed.
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公开(公告)号：US20080028782A1
公开(公告)日：2008-02-07
申请号：US11183333
申请日：2005-07-16
申请人： Charles L. Tilton , Donald E. Tilton , Bruce A. Smetana , Angela R. Maehren , Philip W. Appel , Randall T. Palmer
发明人： Charles L. Tilton , Donald E. Tilton , Bruce A. Smetana , Angela R. Maehren , Philip W. Appel , Randall T. Palmer
CPC分类号： C09K5/041 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An azeotrope spray cooling system for utilizing an azeotrope coolant for improving the performance of a spray cooling system. An azeotrope coolant is utilized within a two-phase thermal management system for thermally managing one or more heat producing devices. The characteristics of the azeotrope coolant may be adjusted for various types of thermal management applications by altering the components of the azeotrope coolant.
摘要翻译： 一种共沸喷雾冷却系统，用于利用共沸冷却剂来改善喷雾冷却系统的性能。 在用于热管理一个或多个发热装置的两相热管理系统中使用共沸冷却剂。 可以通过改变共沸冷却剂的组分来调节各种类型的热管理应用中的共沸混合冷却剂的特性。
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公开(公告)号：US07788939B2
公开(公告)日：2010-09-07
申请号：US11183333
申请日：2005-07-16
申请人： Charles L. Tilton , Donald E. Tilton , Bruce A. Smetana , Angela R. Maehren , Philip W. Appel , Randall T. Palmer
发明人： Charles L. Tilton , Donald E. Tilton , Bruce A. Smetana , Angela R. Maehren , Philip W. Appel , Randall T. Palmer
IPC分类号： F25D23/12
CPC分类号： C09K5/041 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An azeotrope spray cooling system for utilizing an azeotrope coolant for improving the performance of a spray cooling system. An azeotrope coolant is utilized within a two-phase thermal management system for thermally managing one or more heat producing devices. The characteristics of the azeotrope coolant may be adjusted for various types of thermal management applications by altering the components of the azeotrope coolant.
摘要翻译： 一种共沸喷雾冷却系统，用于利用共沸冷却剂来改善喷雾冷却系统的性能。 在用于热管理一个或多个发热装置的两相热管理系统中使用共沸冷却剂。 可以通过改变共沸冷却剂的组分来调节各种类型的热管理应用中的共沸混合冷却剂的特性。
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公开(公告)号：US20110127014A1
公开(公告)日：2011-06-02
申请号：US12323261
申请日：2008-11-25
IPC分类号： F28D15/00
CPC分类号： H05K7/208 , G06F1/20 , G06F1/206 , G06F2200/201
摘要： A globally cooled computer system for providing liquid cooling to a plurality of electrical components. The globally cooled computer system includes an electronics unit having a plurality of electronics components attached to a plurality of cards and a card cage for providing structural support to the cards, a fluid management unit for pressurizing fluid within the electronics unit, a reservoir for collecting fluid from the electronics unit, a tubing system for distributing the fluid between the electronics unit and the fluid management unit, and a pressure equalization system connecting the electronics unit and the reservoir to equalize internal pressures between them.
摘要翻译： 一种全球冷却的计算机系统，用于向多个电气部件提供液体冷却。 全球冷却的计算机系统包括具有附接到多个卡的多个电子部件和用于向卡提供结构支撑的卡笼的电子单元，用于对电子单元内的流体加压的流体管理单元，用于收集流体的储存器 来自电子单元的用于在电子单元和流体管理单元之间分配流体的管道系统以及连接电子单元和储存器以均衡其间的内部压力的压力均衡系统。
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公开(公告)号：US07992626B1
公开(公告)日：2011-08-09
申请号：US11532421
申请日：2006-09-15
IPC分类号： H05K7/20
CPC分类号： H01L23/3732 , F28D15/0266 , F28F3/12 , F28F13/185 , H01L23/427 , H01L23/4735 , H01L2924/0002 , Y10S165/907 , H01L2924/00
摘要： A combination spray and cold plate thermal management system for effectively thermally managing a heat producing device during startup. The combination spray and cold plate thermal management system includes a spray unit thermally managing a heat producing device and a coolant reservoir thermally connected to the heat producing device. The coolant reservoir includes a porous media with coolant channels for storing a volume of the waste coolant after spraying of coolant has terminated. The coolant reservoir is fluidly connected to the spray chamber within the spray unit to receive the waste coolant.
摘要翻译： 组合喷雾和冷板热管理系统，用于在启动期间有效地热管理发热装置。 组合喷雾和冷板热管理系统包括热管理发热装置的喷射单元和与发热装置热连接的冷却剂储存器。 冷却剂储存器包括具有冷却剂通道的多孔介质，用于在喷射冷却剂已经终止之后存储废液冷却剂的体积。 冷却剂储存器流体地连接到喷雾单元内的喷雾室以接收废物冷却剂。
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公开(公告)号：US07469551B2
公开(公告)日：2008-12-30
申请号：US11334269
申请日：2006-01-18
IPC分类号： F25D23/12
CPC分类号： H05K7/208 , G06F1/20 , G06F1/206 , G06F2200/201
摘要： A globally cooled computer system for providing liquid cooling to a plurality of electrical components. The globally cooled computer system includes an electronics unit having a plurality of electronics components attached to a plurality of cards and a card cage for providing structural support to the cards, a fluid management unit for pressurizing fluid within the electronics unit, a reservoir for collecting fluid from the electronics unit, a tubing system for distributing the fluid between the electronics unit and the fluid management unit, and a pressure equalization system connecting the electronics unit and the reservoir to equalize internal pressures between them.
摘要翻译： 一种全球冷却的计算机系统，用于向多个电气部件提供液体冷却。 全球冷却的计算机系统包括具有附接到多个卡的多个电子部件和用于向卡提供结构支撑的卡笼的电子单元，用于对电子单元内的流体加压的流体管理单元，用于收集流体的储存器 来自电子单元的用于在电子单元和流体管理单元之间分配流体的管道系统以及连接电子单元和储存器以均衡其间的内部压力的压力均衡系统。
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公开(公告)号：US07086455B1
公开(公告)日：2006-08-08
申请号：US10955323
申请日：2004-09-30
CPC分类号： F28D15/0266 , F28D5/00 , F28D15/0258 , F28F7/02 , H01L23/4336 , H01L23/4735 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.
摘要翻译： 一种用于有效地管理单个或多个半导体芯片封装的喷雾冷却系统。 喷雾冷却系统包括具有泵单元和储存器的热交换器单元，流体连接到热交换器单元的同轴管，连接到同轴管的耦合器单元和喷射模块，其中耦合器单元可拆卸地连接到 喷雾模块。 热交换器单元具有允许进入和释放空气而不干扰其运行的耐空气设计。
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