公开(公告)号：US11950394B2

公开(公告)日：2024-04-02

申请号：US17499324

申请日：2021-10-12

Applicant: GE AVIATION SYSTEMS LLC

Inventor： Brian Magann Rush ,  Christopher James Kapusta ,  David Richard Esler ,  Liang Yin ,  Richard Anthony Eddins ,  Judd Everett Swanson ,  Liqiang Yang

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20345 ,  H01L23/4735 ,  H05K7/20272 ,  H05K7/20936

Abstract: The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

公开(公告)号：US11920867B2

公开(公告)日：2024-03-05

申请号：US17003488

申请日：2020-08-26

Applicant: Baidu USA LLC

Inventor： Tianyi Gao

IPC: F28B7/00 ,  F28B1/06 ,  F28F25/10 ,  F28F27/00 ,  H05K7/20

CPC classification number: F28B7/00 ,  F28B1/06 ,  F28F25/10 ,  F28F27/003 ,  H05K7/20145 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20345 ,  H05K7/20718 ,  H05K7/208

Abstract: A modular cooling system for data center. An airflow section forms a duct for air flow and a plurality of core units are serially attached to each other and to the airflow section. A blower unit is attached to each of the core units. A plurality of motorized dampers are provided: between each of the core units and the airflow unit, in between each two core units, and between each core unit and its corresponding blower unit. A plurality of fluid ports are attached to each of the core units. At least one of the core units is loaded with one or more equipment selected from: air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, a cooling tower or other types of cooling equipment. A combination operation of the components on the compartment and the cooling units enables fast deployment and operation.

公开(公告)号：US11903171B2

公开(公告)日：2024-02-13

申请号：US17880866

申请日：2022-08-04

Applicant: Nan Chen ,  He Zhao ,  Yunshui Chen

Inventor： Nan Chen ,  He Zhao ,  Yunshui Chen

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20

CPC classification number: H05K7/20809 ,  H05K7/20327 ,  H05K7/20345

Abstract: A system including a heat exchanger section for re-cooling a heated liquid coolant, a spray cooling section for cooling an electronic equipment; mean for separating said heat exchanger or pump section from said spray cooling section; means for transferring heat generated by the electronic equipment to at least liquid coolant; means for spraying the liquid coolant along the heat transferring means to transfer heat from the electronic equipment to the liquid coolant; wherein the heat transferring means is in an essentially vertical position so that the liquid coolant generally flows downward and is drained by gravity; means for collecting the liquid coolant; means for suctioning the collected liquid coolant; means for pumping the dielectric liquid coolant from the sprayed liquid coolant collecting means and through the liquid coolant spraying means; and means for housing the system.

公开(公告)号：US20180077826A1

公开(公告)日：2018-03-15

申请号：US15813293

申请日：2017-11-15

Applicant: IHI Corporation ,  National University Corporation Tokyo University of Agriculture and Technology

Inventor： Yoji OKITA ,  Akira Murata

IPC: H05K7/20

CPC classification number: H05K7/20909 ,  B64C25/36 ,  H05K7/20172 ,  H05K7/20345 ,  H05K7/2039 ,  H05K7/20918 ,  H05K7/20936

Abstract: A cooling device includes a heat sink that includes a plurality of first heat radiating fins and a plurality of second heat radiating fins, and a compressor as a blower that causes cooling air to flow from an inlet toward an outlet of a cooling passage of the heat sink. The cooling device includes in a flow direction of the cooling air that passes via the heat sink a mist supplier arranged upstream of the heat sink and that supplies mist M to the cooling passage of the heat sink.

公开(公告)号：US20170290203A1

公开(公告)日：2017-10-05

申请号：US15474008

申请日：2017-03-30

Applicant: EMERSON NETWORK POWER S.R.L.

Inventor： Filippo MASETTO ,  Daniele DE ZEN

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  F24F3/1405 ,  F24F5/0035 ,  F24F12/006 ,  H05K7/20327 ,  H05K7/20345 ,  H05K7/20745 ,  H05K7/20827 ,  Y02B30/563

Abstract: A heat exchange device for air cooling for conditioning and climate control systems for server rooms and the like, which comprises: an air/air heat exchanger, designed to be passed through by a primary air stream along a first trajectory from an intake region to an outflow region and by a secondary air stream along a second trajectory from a corresponding intake region to a corresponding outflow region, water dispensing elements adapted to wet the heat exchanger downward from above, elements of collecting the water that descends from the heat exchanger, a recirculation pump for returning the air-cooling water from the collection elements up to the dispensing elements arranged above the heat exchanger; the water dispensing elements comprise a plurality of nozzles arranged side by side, or rows of nozzles, which are adapted to dispense water with a flow-rate that decreases starting from the intake region for the primary air stream toward the outflow region of the heat exchanger.

公开(公告)号：US09713290B2

公开(公告)日：2017-07-18

申请号：US14320019

申请日：2014-06-30

Applicant: MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor： Sean James ,  Todd Robert Rawlings

IPC: H01L23/473 ,  H05K7/20 ,  H01L23/427

CPC classification number: H05K7/20818 ,  H01L23/427 ,  H01L23/473 ,  H05K7/203 ,  H05K7/20327 ,  H05K7/20345 ,  H05K7/2079 ,  H05K7/20809

Abstract: The subject disclosure is directed towards a datacenter or partial datacenter (e.g., a datacenter module) contained in a sealed container. The container may be filled with a cooling fluid, such as a dielectric fluid, to help cool the datacenter components. The container and its internal datacenter or datacenter portion may be submerged in water, in which event the fluid also helps to equalize the external water pressure.

公开(公告)号：US08974274B2

公开(公告)日：2015-03-10

申请号：US12761981

申请日：2010-04-16

Applicant: Andrew B. Carlson

Inventor： Andrew B. Carlson

IPC: H05K5/00 ,  H05K7/20 ,  F24F5/00 ,  F28D5/00 ,  F24F1/00

CPC classification number: H05K7/20827 ,  F24F5/0035 ,  F24F2001/0088 ,  F24F2001/0092 ,  F24F2203/104 ,  F28D5/00 ,  H05K7/20172 ,  H05K7/202 ,  H05K7/20309 ,  H05K7/20345 ,  H05K7/20836 ,  Y02B30/545

Abstract: A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone.

Abstract translation: 数据中心冷却系统包括蒸发冷却系统。 蒸发冷却系统包括被配置为在环境条件下通过数据中心的进入区循环外部空气的风扇，以及位于进入区域上游的雾化器，其配置成将雾化水喷射到循环的外部空气中。 雾化水在蒸发区中蒸发并冷却外部空气以产生冷却的空气，冷却的空气被引导通过定位在蒸发区下游的计算机的机架。

公开(公告)号：US20110075353A1

公开(公告)日：2011-03-31

申请号：US12902375

申请日：2010-10-12

Applicant: Chad Daniel Attlesey ,  R. Daren Klum ,  Allen James Berning

Inventor： Chad Daniel Attlesey ,  R. Daren Klum ,  Allen James Berning

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H05K7/20236 ,  H05K7/20263 ,  H05K7/20345 ,  H05K7/20772 ,  Y10S165/908 ,  H01L2924/00

Abstract: A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling; heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device, such as a fan can be used to blow air across the heat exchanger to increase heat transfer.

Abstract translation: 一种便携式，独立的液体浸入式冷却系统，适用于冷却多种电子设备，包括冷却; 使用电子，发热部件的计算机系统和其他系统中的发热部件。 电子设备包括具有内部空间的壳体，内部空间中的介电冷却液体，设置在该空间内并浸没在电介质冷却液体中的发热电子部件，以及用于将液体泵入和流出的泵 空间，来自和从固定到外部空间外壳的热交换器。 热交换器包括冷却液入口，冷却液出口和用于冷却从冷却液入口到冷却液出口的液体的流路。 诸如风扇的空气移动装置可以用于吹过热交换器以增加热传递。

公开(公告)号：US07779896B2

公开(公告)日：2010-08-24

申请号：US11944244

申请日：2007-11-21

Applicant: Charles L Tilton ,  Donald Tilton ,  Thomas D Weir ,  Randall T. Palmer

Inventor： Charles L Tilton ,  Donald Tilton ,  Thomas D Weir ,  Randall T. Palmer

IPC: F28D15/02

CPC classification number: F28D15/0266 ,  F28D5/00 ,  H01L23/4735 ,  H01L2924/0002 ,  H05K7/20345 ,  H01L2924/00

Abstract: A fluid recovery system is adapted for use with a cooling system, such as for use in electronic applications. In one example, an enclosure is configured to contain fluid in both gas and liquid states, wherein the fluid is adapted for use in spray cooling electronic components. A plurality of pick-up ports is defined within the enclosure. In one implementation of the cooling system, an orifice size used in each of the pick-up ports results in withdrawal of fluid from submerged and non-submerged pick-up ports.

Abstract translation: 流体回收系统适于与冷却系统一起使用，例如用于电子应用中。 在一个示例中，壳体被配置为容纳气体和液体状态的流体，其中流体适用于喷射冷却电子部件。 在外壳内限定多个拾取口。 在冷却系统的一个实施方案中，在每个拾取口中使用的孔口尺寸导致流体从浸没和非浸没的拾取口中排出。

公开(公告)号：US20090266516A1

公开(公告)日：2009-10-29

申请号：US12430091

申请日：2009-04-26

Applicant: Nels E. Jewell-Larsen ,  Chih-Peng Hsu ,  Alexander V. Mamishev ,  Igor A. Krichtafovitch ,  Hsiu-Che Wang

Inventor： Nels E. Jewell-Larsen ,  Chih-Peng Hsu ,  Alexander V. Mamishev ,  Igor A. Krichtafovitch ,  Hsiu-Che Wang

IPC: F28D11/06 ,  B05B5/053 ,  B05B5/16 ,  F28D15/00

CPC classification number: F28D5/00 ,  B05B5/0255 ,  F25B2339/021 ,  F28F13/02 ,  H01L23/427 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20345 ,  H01L2924/00

Abstract: Electrospray evaporative cooling (ESC). Means for effectuating thermal management using electrospray cooling are presented herein. An ESC may be implemented having one or more nozzles situated to spray droplets of a fluid towards a target. Because the fluid may be electrolytic, an electric field may be established between the one or more nozzles and the target can be operative to govern the direction, rate, etc. of the electrospraying between the one or more nozzles and the target. An additional shielding/field enhancement electrode may also be implemented between the one or more nozzles and the target. A droplet movement mechanism may be employed to transport droplets received at a first location of the target so that evaporation thereof may occur relatively more at a second location of the target. An ESC device may be implemented to effectuate thermal management of any of a variety of types of electronic devices.

Abstract translation: 电喷雾蒸发冷却（ESC）。 本文介绍了使用电喷雾冷却实现热管理的手段。 ESC可以被实现为具有一个或多个喷嘴，其被定位成朝向目标喷射流体液滴。 因为流体可以是电解的，所以可以在一个或多个喷嘴之间建立电场，并且靶可以用于控制一个或多个喷嘴和靶之间的电喷雾的方向，速率等。 还可以在一个或多个喷嘴和靶之间实施附加的屏蔽/场增强电极。 可以使用液滴移动机构来输送在靶的第一位置接收的液滴，使得其在目标的第二位置处的相对更多的蒸发。 可以实现ESC装置来实现各种类型的电子装置中的任何一种的热管理。