公开(公告)号：US06701199B1

公开(公告)日：2004-03-02

申请号：US10225804

申请日：2002-08-22

申请人： Cheng Chor Shu ,  Cho Nam Hoon ,  Leong Chee Kong ,  Pete Benyon ,  Johnny Cham ,  George Wong ,  Neoh Soon Ee

发明人： Cheng Chor Shu ,  Cho Nam Hoon ,  Leong Chee Kong ,  Pete Benyon ,  Johnny Cham ,  George Wong ,  Neoh Soon Ee

IPC分类号： G06F1900

CPC分类号： G05B19/4188 ,  H01L21/67276 ,  Y02P90/24 ,  Y02P90/26

摘要： In accordance with the objectives of the invention a new methodology is provided that assures that integrated process results are verified and assured prior to the installation of processing tools as part of modifying or updating of a semiconductor manufacturing foundry. The complete semiconductor manufacturing complement of processing tools is sub-divided into short-loops or sub-modules, which are then combined into a full loop. This combination of sub-modules into modules that closer approach a full complement of processing tools can be accomplished in a gradual manner, whereby one or more sub-loops are first combined and evaluated, to this combination one or more additional sub-groups may be added whereby each of these latter sub-groups may also have been created by combining one or more (original) sub-loops. This process is continued to the point where a full complement of process equipment has been created, completing the full processing loops of the semiconductor manufacturing facility.

摘要翻译： 根据本发明的目的，提供了一种新的方法，其确保在作为修改或更新半导体制造代工厂的一部分之前，在安装处理工具之前验证并确保综合的处理结果。 加工工具的完整半导体制造补充被分为短环或子模块，然后将其组合成一个完整的循环。 将子模块组合成更接近整个处理工具的模块的组合可以以逐步的方式完成，由此首先将一个或多个子回路组合和评估到该组合中，一个或多个附加子组可以是 其中这些后一子组中的每一个也可以通过组合一个或多个（原始）子回路而创建。 这个过程继续到已经完成了完整的工艺设备的创建，完成了半导体制造设备的完整处理循环。