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23 条记录 (耗时 0.046 秒)

    Methodology to obtain integrated process results prior to process tools being installed
    1.
    发明授权
    Methodology to obtain integrated process results prior to process tools being installed 失效
    在安装过程工具之前获得集成过程结果的方法

    公开(公告)号：US06701199B1

    公开(公告)日：2004-03-02

    申请号：US10225804

    申请日：2002-08-22

    申请人： Cheng Chor Shu ,  Cho Nam Hoon ,  Leong Chee Kong ,  Pete Benyon ,  Johnny Cham ,  George Wong ,  Neoh Soon Ee

    发明人： Cheng Chor Shu ,  Cho Nam Hoon ,  Leong Chee Kong ,  Pete Benyon ,  Johnny Cham ,  George Wong ,  Neoh Soon Ee

    IPC分类号： G06F1900

    CPC分类号： G05B19/4188 ,  H01L21/67276 ,  Y02P90/24 ,  Y02P90/26

    摘要： In accordance with the objectives of the invention a new methodology is provided that assures that integrated process results are verified and assured prior to the installation of processing tools as part of modifying or updating of a semiconductor manufacturing foundry. The complete semiconductor manufacturing complement of processing tools is sub-divided into short-loops or sub-modules, which are then combined into a full loop. This combination of sub-modules into modules that closer approach a full complement of processing tools can be accomplished in a gradual manner, whereby one or more sub-loops are first combined and evaluated, to this combination one or more additional sub-groups may be added whereby each of these latter sub-groups may also have been created by combining one or more (original) sub-loops. This process is continued to the point where a full complement of process equipment has been created, completing the full processing loops of the semiconductor manufacturing facility.

    摘要翻译： 根据本发明的目的，提供了一种新的方法，其确保在作为修改或更新半导体制造代工厂的一部分之前，在安装处理工具之前验证并确保综合的处理结果。 加工工具的完整半导体制造补充被分为短环或子模块，然后将其组合成一个完整的循环。 将子模块组合成更接近整个处理工具的模块的组合可以以逐步的方式完成，由此首先将一个或多个子回路组合和评估到该组合中，一个或多个附加子组可以是 其中这些后一子组中的每一个也可以通过组合一个或多个（原始）子回路而创建。 这个过程继续到已经完成了完整的工艺设备的创建，完成了半导体制造设备的完整处理循环。

    Fill pattern in kerf areas to prevent localized non-uniformities of insulating layers at die corners on semiconductor substrates
    3.
    发明授权
    Fill pattern in kerf areas to prevent localized non-uniformities of insulating layers at die corners on semiconductor substrates 失效

    公开(公告)号：US06211050B1

    公开(公告)日：2001-04-03

    申请号：US09261681

    申请日：1999-03-03

    申请人： George Wong

    发明人： George Wong

    IPC分类号： H01L2144

    CPC分类号： H01L21/76819 ,  G02F1/13454

    摘要： A method for making a planar spin-on-glass (SOG) layer over integrated circuits at the corners of the chip (die) areas is achieved. This method allows more reliable integrated circuits to be made, and is particularly useful for liquid crystal displays (LCDs) by eliminating optical distortion at the corners of the LCD die areas. When a conducting layer is patterned to form portions of the integrated circuits over the chip areas, the layer is concurrently patterned to form a fill layer in the kerf areas. The spacing between the fill layer in the kerf areas and the edges of the patterned conducting layer in the die areas is selected to have a width sufficiently narrow to provide a uniform coating of SOG over the corners of the die areas without buildup of the SOG. After depositing a thin SiOx cap layer, a uniform SOG layer is deposited. The fill layer in the kerf areas also prevents dishing of the SOG layer when the SOG is chem-mech polished back. The process steps of this invention can be repeated to provide multilevels of electrical interconnections as required to complete the integrated circuits without causing non-uniformity of the SOG at the die corners.

    System and method for robotic digital scanning of teeth
    4.
    发明申请
    System and method for robotic digital scanning of teeth 审中-公开
    机器人数字扫描牙齿的系统和方法

    公开(公告)号：US20170020636A1

    公开(公告)日：2017-01-26

    申请号：US15130269

    申请日：2016-04-15

    申请人： Hadi Akeel ,  George Wong

    发明人： Hadi Akeel ,  George Wong

    IPC分类号： A61C9/00 ,  A61B1/24 ,  A61C19/04 ,  A61C13/00 ,  A61C13/34 ,  A61B1/00 ,  A61B34/30

    CPC分类号： A61B34/30 ,  A61B1/00172 ,  A61B1/24 ,  A61C9/0053 ,  A61C13/0004

    摘要： A method of scanning a patient's mouth using a robot to obtain a 3-D model of the patient's teeth. A database can contain a 3D model of a generic jaw geometry approximated in size by geometric parameters and at least one jaw scanning pattern. Geometric measurements of a patient's jaw are taken, then these are applied to the geometric parameters of the generic jaw. A predetermined scanning pattern is used to program the robot to scan the teeth with a scanner. The robot program is executed to move the scanner along the jaw scanning pattern at a fixed or variable distance from surfaces of the patient's jaw in sequences of coverage to the end of a scanning pattern to produce a three-dimensional (3D) model of the patient's teeth.

    摘要翻译： 使用机器人扫描患者口腔的方法来获得患者牙齿的3-D模型。 数据库可以包含通过几何参数和至少一个钳口扫描模式大小近似的通用钳口几何的3D模型。 拍摄患者颌骨的几何测量值，然后将其应用于通用颌骨的几何参数。 使用预定的扫描图案来编程机器人以扫描仪扫描牙齿。 执行机器人程序以使扫描仪沿着钳口扫描图案以距离病人钳口表面的固定或可变距离沿覆盖序列移动到扫描图案的末端以产生患者的三维（3D）模型 牙齿

    Sound isolation cap
    7.
    发明申请
    Sound isolation cap 审中-公开
    隔音盖

    公开(公告)号：US20060188114A1

    公开(公告)日：2006-08-24

    申请号：US11338190

    申请日：2006-01-24

    申请人： George Wong ,  Noland Lewis

    发明人： George Wong ,  Noland Lewis

    IPC分类号： H04R25/00

    CPC分类号： H04R1/00

    摘要： A sound isolation cap for use with a sound level meter. The cap has a bore in which a plug snugly fits. The plug, in the open position, allows air to travel between the exterior of the cap and the cap's interior cavity. In the closed position, the plug prevents air from traveling between the exterior of the cap and the interior cavity. Air may travel between the interior cavity and the exterior of the cap by way of two passages. One passage connects the interior cavity with the bore while the other passage connects the bore with the exterior of the cap. When in use, the microphone of the sound level meter is inserted into the interior cavity.

    摘要翻译： 用于声级计的隔音盖。 盖子有一个孔，其中一个插头贴合。 处于打开位置的塞子允许空气在盖的外部和盖的内部空腔之间行进。 在关闭位置，塞子防止空气在盖的外部和内部空腔之间行进。 空气可以通过两个通道在内部空腔和盖的外部之间行进。 一个通道将内腔与孔连接，而另一个通道将孔与盖的外部连接。 在使用中，声级计的麦克风插入内腔。

    Photolithographic methods for making liquid-crystal-on-silicon displays with alignment posts and optical interference layers
    9.
    发明授权
    Photolithographic methods for making liquid-crystal-on-silicon displays with alignment posts and optical interference layers 失效
    用于制备具有对准柱和光学干涉层的硅晶体显示器的光刻方法

    公开(公告)号：US06815239B1

    公开(公告)日：2004-11-09

    申请号：US09262000

    申请日：1999-03-05

    申请人： Sik On Kong ,  Rajan Rajgopal ,  George Wong

    发明人： Sik On Kong ,  Rajan Rajgopal ,  George Wong

    IPC分类号： H01L2100

    CPC分类号： G02F1/13394 ,  G02F1/133553 ,  G02F1/136277

    摘要： Five new methods for the formation of an improved liquid-crystal-on-silicon display are described, in which the device structure is enhanced by the photolithographic building of alignment posts among the mirror pixels of the micro-display. These five methods accommodate the fabrication of an optical interference multilayer, which improves the image quality of the reflected light. These five methods are: Silicon Dioxide Posts by Wet Etching. Amorphous Silicon Posts by Plasma Etching. Silicon Nitride Posts by Plug Filling. Insulation Material Posts by Lift-off. Polyimide Posts by Photosensitive Etching.

    摘要翻译： 描述了用于形成改进的液晶显示器的五种新方法，其中通过微显示器的反射镜像素中的对准柱的光刻建筑来增强器件结构。 这五种方法适应光学干涉多层的制造，这提高了反射光的图像质量。 这五种方法是：湿法蚀刻二氧化硅柱。等离子体蚀刻的非晶硅柱。通过插塞填充的氮化硅柱。通过光敏蚀刻剥离聚酰亚胺柱的绝缘材料柱。