Abstract:
A package substrate of the present invention at least comprises a metal substrate and a plurality of light emitting dies. The metal substrate is provided thereon with at least one trench. The trench is recessed into the surface of the metal substrate through an insulating layer. The light emitting dies are secured in the trench and electrically connected to a predetermined wiring layer on the metal substrate by metal wires, thereby obtaining a light emitting die package substrate with good thermal conductivity, high heat dissipation, separate electrical and thermal paths and a simple and firm structure.
Abstract:
A lamp including a carrier and a plurality of light source modules stacked to the carrier is provided. Each light source module includes a circuit board and a plurality of light-emitting diodes, wherein the light-emitting diodes are disposed on at least one side of the circuit board and electrically connected to the circuit board.
Abstract:
FIG. 1 is a perspective view of a pergola showing my new design; FIG. 2 is a front elevational view thereof; FIG. 3 is a rear elevational view thereof; FIG. 4 is a left side elevational view thereof; FIG. 5 is a right side elevational view thereof; FIG. 6 is a top plan view thereof; FIG. 7 is a bottom plan view thereof; FIG. 8 is a partial enlarged view of label 8 from FIG. 2; FIG. 9 is a partial enlarged view of label 9 from FIG. 2; FIG. 10 is a partial enlarged view of label 10 from FIG. 2; FIG. 11 is a partial enlarged view of label 11 from FIG. 4; FIG. 12 is a partial enlarged view of label 12 from FIG. 4; and, FIG. 13 is a partial enlarged view of label 13 from FIG. 4. The broken lines in FIGS. 2, 4, and 8 through 13 identify the locations and boundaries of the areas of enlargement for the partial enlarged views, and form no part of the claimed design.
Abstract:
A combination frame material comprises an outer frame and an inner frame. The outer frame has an outer side and an inner side, with the inner side provided with two parallel combining grooves with a middle pillar disposed therebetween for dividing the two combining grooves. The inner frame has two parallel combining parts for being transversely received in the two combining grooves, with a pillar groove disposed between the two combining parts for receiving the middle pillar. Thus, the outer frame and the inner frame are allowed to be combined easily and efficiently.
Abstract:
A lamp including a carrier and a plurality of light source modules stacked to the carrier is provided. Each light source module includes a circuit board and a plurality of light-emitting diodes, wherein the light-emitting diodes are disposed on at least one side of the circuit board and electrically connected to the circuit board.
Abstract:
A fixing mechanism for fixing a heat-dissipating device includes a plurality of thermal fins whereon a ditch is formed, and a positioning device disposed on the plurality of thermal fins. The positioning device includes a supporting portion, and a first side of the supporting portion is for supporting the heat-dissipating device. The positioning device further includes a first constraining portion connected to a second side of the supporting portion and engaged with the ditch for preventing the supporting portion from moving relative to the plurality of thermal fins in a first direction, and a second constraining portion connected to the second side of the supporting portion and contacting against the plurality of thermal fins for preventing the supporting portion from moving relative to the plurality of thermal fins in a second direction different from the first direction.