公开(公告)号：US20110003431A1

公开(公告)日：2011-01-06

申请号：US12882324

申请日：2010-09-15

Applicant: Cheng-Tang HUANG

Inventor： Cheng-Tang HUANG

IPC: H01L21/50

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/83191 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

Abstract: A die rearrangement package structure is provided and includes a die; an encapsulated structure is covered around the four sides of the die to expose the active surface and the reverse side of the die; a patterned protective layer is formed on the encapsulated structure and the active surface of the die, and the pads is to be exposed; one end of fan-out patterned metal layer is electrically connected the pads and other end is extended to cover the patterned protective layer; patterned second protective layer is provided to cover the patterned metal layer to expose the portions surface of the patterned metal layer; patterned UBM layer is formed on the exposed surface of the patterned metal layer; and a conductive component is formed on the patterned UBM layer, and electrically connected the patterned metal layer.

Abstract translation: 提供了一种管芯重排封装结构，包括一个管芯; 封装结构围绕模具的四个侧面被覆盖以暴露模具的活性表面和反面; 在封装结构和芯片的有源表面上形成图案化保护层，并且焊盘被暴露; 扇出图案化金属层的一端电连接焊盘，另一端延伸以覆盖图案化的保护层; 图案化的第二保护层被提供以覆盖图案化的金属层以暴露图案化金属层的部分表面; 图案化的UBM层形成在图案化金属层的暴露表面上; 并且在图案化的UBM层上形成导电部件，并且电连接图案化的金属层。

公开(公告)号：US20090302465A1

公开(公告)日：2009-12-10

申请号：US12330764

申请日：2008-12-09

Applicant: Cheng-Tang HUANG

Inventor： Cheng-Tang HUANG

IPC: H01L21/50 ,  H01L21/768 ,  H01L23/498

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/83191 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

Abstract: A die rearrangement package structure is provided and includes a die; an encapsulated structure is covered around the four sides of the die to expose the active surface and the reverse side of the die; a patterned protective layer is formed on the encapsulated structure and the active surface of the die, and the pads is to be exposed; one end of fan-out patterned metal layer is electrically connected the pads and other end is extended to cover the patterned protective layer; patterned second protective layer is provided to cover the patterned metal layer to expose the portions surface of the patterned metal layer; patterned UBM layer is formed on the exposed surface of the patterned metal layer; and a conductive component is formed on the patterned UBM layer, and electrically connected the patterned metal layer.

Abstract translation: 提供了一种管芯重排封装结构，包括一个管芯; 封装结构围绕模具的四个侧面被覆盖以暴露模具的活性表面和反面; 在封装结构和芯片的有源表面上形成图案化保护层，并且焊盘被暴露; 扇出图案化金属层的一端电连接焊盘，另一端延伸以覆盖图案化的保护层; 图案化的第二保护层被提供以覆盖图案化的金属层以暴露图案化金属层的部分表面; 图案化的UBM层形成在图案化金属层的暴露表面上; 并且在图案化的UBM层上形成导电部件，并且电连接图案化的金属层。