公开(公告)号：US20220208731A1

公开(公告)日：2022-06-30

申请号：US17545229

申请日：2021-12-08

Applicant: Chengdu Monolithic Power Systems Co., Ltd.

Inventor： Yingjiang Pu ,  Hunt Jiang

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56

Abstract: A multi-die package structure with an embedded die embedded in a substrate, a flip chip die mounted above the substrate, and an attached die attached onto the flip chip die. The package is compact and low cost.

公开(公告)号：US20220199581A1

公开(公告)日：2022-06-23

申请号：US17544075

申请日：2021-12-07

Applicant: Chengdu Monolithic Power Systems Co., Ltd.

Inventor： Yingjiang Pu ,  Hunt Jiang

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00

Abstract: A multi-die package structure with an embedded die embedded in a substrate, a high flip chip die mounted above the substrate, and a low flip chip die placed below the substrate. The package is compact and low cost.

公开(公告)号：US12002787B2

公开(公告)日：2024-06-04

申请号：US17545229

申请日：2021-12-08

Applicant: Chengdu Monolithic Power Systems Co., Ltd.

Inventor： Yingjiang Pu ,  Hunt Jiang

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L21/56 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48227

Abstract: A multi-die package structure with an embedded die embedded in a substrate, a flip chip die mounted above the substrate, and an attached die attached onto the flip chip die. The package is compact and low cost.

公开(公告)号：US20220208732A1

公开(公告)日：2022-06-30

申请号：US17545282

申请日：2021-12-08

Applicant: Chengdu Monolithic Power Systems Co., Ltd.

Inventor： Yingjiang Pu ,  Hunt Jiang

IPC: H01L25/065 ,  H01L23/48 ,  H01L23/00

Abstract: A multi-die co-packed module with an embedded die embedded in a substrate, an electrical component mounted above the substrate, and a flip chip die placed between the substrate and the electrical component or below the substrate. The package is compact and low cost.