公开(公告)号：USD664510S1

公开(公告)日：2012-07-31

申请号：US29402453

申请日：2011-09-23

Applicant: Chi-Kuon Wang

Designer： Chi-Kuon Wang

公开(公告)号：US08766304B2

公开(公告)日：2014-07-01

申请号：US13616637

申请日：2012-09-14

Applicant: Chi-Kuon Wang

Inventor： Chi-Kuon Wang

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/50 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A package structure of semiconductor light emitting element is provided. The package structure of semiconductor light emitting element includes a substrate, a light emitting element and a transparent conductive board. A first electrode and a second electrode are disposed on the substrate. The light emitting element is disposed on the substrate and between the first electrode and the second electrode. A first bonding pad and a second bonding pad are disposed on the light emitting element. The transparent conductive board has a first surface and a second surface opposite to the first surface. The second surface of the transparent conductive board is located over the light emitting element for electrically connecting the first electrode and the first bonding pad and electrically connecting the second electrode and the second bonding pad.

Abstract translation: 提供半导体发光元件的封装结构。 半导体发光元件的封装结构包括衬底，发光元件和透明导电板。 第一电极和第二电极设置在基板上。 发光元件设置在基板上并且在第一电极和第二电极之间。 第一接合焊盘和第二接合焊盘设置在发光元件上。 透明导电板具有与第一表面相对的第一表面和第二表面。 透明导电板的第二表面位于发光元件上方，用于电连接第一电极和第一焊盘，并电连接第二电极和第二焊盘。

公开(公告)号：USD664109S1

公开(公告)日：2012-07-24

申请号：US29402484

申请日：2011-09-23

Applicant: Chi-Kuon Wang

Designer： Chi-Kuon Wang

公开(公告)号：USD664107S1

公开(公告)日：2012-07-24

申请号：US29402468

申请日：2011-09-23

Applicant: Chi-Kuon Wang

Designer： Chi-Kuon Wang

公开(公告)号：US20130069094A1

公开(公告)日：2013-03-21

申请号：US13616637

申请日：2012-09-14

Applicant: Chi-Kuon Wang

Inventor： Chi-Kuon Wang

IPC: H01L33/44

CPC classification number: H01L33/62 ,  H01L33/50 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A package structure of semiconductor light emitting element is provided. The package structure of semiconductor light emitting element includes a substrate, a light emitting element and a transparent conductive board. A first electrode and a second electrode are disposed on the substrate. The light emitting element is disposed on the substrate and between the first electrode and the second electrode. A first bonding pad and a second bonding pad are disposed on the light emitting element. The transparent conductive board has a first surface and a second surface opposite to the first surface. The second surface of the transparent conductive board is located over the light emitting element for electrically connecting the first electrode and the first bonding pad and electrically connecting the second electrode and the second bonding pad.

Abstract translation: 提供半导体发光元件的封装结构。 半导体发光元件的封装结构包括衬底，发光元件和透明导电板。 第一电极和第二电极设置在基板上。 发光元件设置在基板上并且在第一电极和第二电极之间。 第一接合焊盘和第二接合焊盘设置在发光元件上。 透明导电板具有与第一表面相对的第一表面和第二表面。 透明导电板的第二表面位于发光元件上方，用于电连接第一电极和第一焊盘，并电连接第二电极和第二焊盘。

公开(公告)号：USD664108S1

公开(公告)日：2012-07-24

申请号：US29402479

申请日：2011-09-23

Applicant: Chi-Kuon Wang

Designer： Chi-Kuon Wang