公开(公告)号：US06967403B2

公开(公告)日：2005-11-22

申请号：US10872190

申请日：2004-06-18

申请人： Chi-Ta Chuang ,  Chih-Min Pao ,  Chien Liu ,  Chi-Hao Chiu

发明人： Chi-Ta Chuang ,  Chih-Min Pao ,  Chien Liu ,  Chi-Hao Chiu

IPC分类号： H01L23/36 ,  H01L23/552 ,  H01L23/34

CPC分类号： H01L23/552 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/166 ,  H01L2924/3025 ,  H01L2224/0401

摘要： A package structure with a heat spreader and manufacturing method thereof is disclosed. The package structure includes a substrate, a ground pad, a heat spreader, a non-conductive adhesive layer, and a pre-solder layer. A die is seated on the substrate, and the ground pad is disposed on the surface of the substrate. The manufacturing method of the package structure includes the following steps: (a) providing the substrate; (b) forming the pre-solder layer on the ground pad by solder paste printing; (c) forming the non-conductive adhesive layer on the substrate surface for being adjacent to the pre-solder layer by adhesive dispensing; (d) disposing the heat spreader onto the non-conductive layer and the pre-solder layer; and (e) heating the non-conductive adhesive layer for solidification and continuing to heat the pre-solder layer for solder reflow so that the heat spreader is adhered to the substrate via the non-conductive adhesive layer and coupled to the ground pad via the pre-solder layer.

摘要翻译： 公开了具有散热器的封装结构及其制造方法。 封装结构包括衬底，接地垫，散热器，非导电粘合剂层和预焊料层。 模具坐在基板上，接地垫设置在基板的表面上。 封装结构的制造方法包括以下步骤：（a）提供衬底; （b）通过焊膏印刷在接地焊盘上形成预焊料层; （c）通过粘合剂分配在所述基板表面上形成与所述预焊料层相邻的所述非导电粘合剂层; （d）将散热器设置在非导电层和预焊料层上; 和（e）加热不导电粘合剂层以进行固化，并继续加热用于焊料回流的预焊料层，使得散热器经由非导电粘合剂层粘合到基板上，并经由 预焊层。

公开(公告)号：US06929980B2

公开(公告)日：2005-08-16

申请号：US10874273

申请日：2004-06-24

申请人： Chi-Hao Chiu ,  Yu-Wen Chen ,  Chi-Ta Chuang ,  Chi-Sheng Chao

发明人： Chi-Hao Chiu ,  Yu-Wen Chen ,  Chi-Ta Chuang ,  Chi-Sheng Chao

IPC分类号： H01L21/56 ,  H01L21/44

CPC分类号： H01L21/563 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

摘要： A manufacturing method of a flip chip package mainly comprises the following steps. Initially, a chip having an active surface with a plurality of bumps formed thereon is provided. Next, the active surface of the chip is faced to and disposed on an upper surface of a substrate. In such manner, the chip will be electrically connected to the substrate and a gap between the chip and the substrate will be formed. Afterwards, an underfill is filled in the gap and then a first curing process is performed to have the underfill partially hardened to have the underfill transformed into a partially hardened underfill. Finally, the combination of the chip, the substrate and the partially hardened underfill is flipped over to have the substrate located above the chip, then a second curing process is performed to have the partially hardened underfill into a fully hardened underfill, and then flipping over the combination of the chip, the substrate and the fully hardened underfill.

摘要翻译： 倒装芯片封装的制造方法主要包括以下步骤。 首先，提供具有形成有多个凸块的活性表面的芯片。 接下来，芯片的有源表面面向并设置在基板的上表面上。 以这种方式，芯片将电连接到基板，并且将形成芯片和基板之间的间隙。 之后，在该间隙中填充底部填充物，然后执行第一固化过程以将底部填充部分硬化以将底部填充物转化为部分硬化的底部填充物。 最后，将芯片，基板和部分硬化的底部填充物的组合翻转以使基板位于芯片上方，然后执行第二固化工艺以使部分硬化的底部填充物成为完全硬化的底部填充物，然后翻转 芯片，基板和完全硬化的底部填充物的组合。