公开(公告)号：US20110148288A1

公开(公告)日：2011-06-23

申请号：US12820645

申请日：2010-06-22

申请人： Chieh Wei Chen ,  Chun Hsiang Fang

发明人： Chieh Wei Chen ,  Chun Hsiang Fang

IPC分类号： H01J1/63 ,  H01J9/02

CPC分类号： H01L27/3204 ,  H01L27/3244

摘要： A contact structure for organic luminescent devices is provided. The contact structure includes a first conductive layer, at least one pillar, an organic light-emitting layer, and a second conductive layer. The first conductive layer has a contact region. The at least one pillar is positioned on the first conductive layer in the contact region. The organic light-emitting layer covers the first conductive layer in the contact region and exposing a portion of the first conductive layer around the pillar in the contact region. The second conductive layer covers an exposed portion of the first conductive layer in the contact region. In one embodiment of the present invention, the pillar has a top surface and a bottom surface, and the width of the top surface is larger than that of the bottom surface.

摘要翻译： 提供了一种有机发光装置的接触结构。 接触结构包括第一导电层，至少一个柱，有机发光层和第二导电层。 第一导电层具有接触区域。 所述至少一个支柱位于所述接触区域中的所述第一导电层上。 有机发光层覆盖接触区域中的第一导电层，并使第一导电层的一部分在接触区域中的柱子周围露出。 第二导电层覆盖接触区域中第一导电层的暴露部分。 在本发明的一个实施例中，柱具有顶表面和底表面，并且顶表面的宽度大于底表面的宽度。

公开(公告)号：US06696325B1

公开(公告)日：2004-02-24

申请号：US10424464

申请日：2003-04-28

申请人： Yaw-Ming Tsai ,  Chun Hsiang Fang ,  Cheng-Hsun Tsai

发明人： Yaw-Ming Tsai ,  Chun Hsiang Fang ,  Cheng-Hsun Tsai

IPC分类号： H01L2100

CPC分类号： H01L21/76251 ,  G02F1/133305 ,  G02F2001/13613 ,  Y10S438/977

摘要： A method of transferring a thin film device onto a plastic sheet. A silver-containing buffer layer is formed on a glass substrate. A transferred layer including a thin film device is formed on part of the silver-containing buffer layer. At least one first hole penetrates the transferred layer and an edge of the silver-containing buffer layer is exposed. A first plastic layer including at least one second hole is adhered to the transferred layer with a removable glue, wherein the second hole corresponds to the first hole, and part of the first plastic layer is located above the edge of the silver-containing buffer layer. The silver-containing buffer layer is oxidized to expand, thereby separating the silver-containing buffer layer from the transferred layer. A second plastic layer is adhered to the transferred layer. The removable glue is eliminated to remove the first plastic layer.

摘要翻译： 将薄膜装置转印到塑料薄片上的方法。 在玻璃基板上形成含银缓冲层。 在含银缓冲层的一部分上形成包括薄膜器件的转移层。 至少一个第一孔穿透转移层，并且含银缓冲层的边缘被暴露。 包括至少一个第二孔的第一塑料层用可移除的胶粘在转移层上，其中第二孔对应于第一孔，第一塑料层的一部分位于含银缓冲层的边缘的上方 。 含银缓冲层被氧化膨胀，从而将含银缓冲层与转移层分离。 第二塑料层粘附到转移层。 去除可去除的胶水以去除第一塑料层。